LFDAS12XSDT Freescale Semiconductor, LFDAS12XSDT Datasheet - Page 144

• Manufacturer Part Number: LFDAS12XSDT
• Description: HARDWARE MC9S12XS 52-PIN
• Manufacturer: Freescale Semiconductor

Specifications of LFDAS12XSDT

• Module/board Type: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: -

Memory Mapping Control (S12XMMCV4)
3.4.2.3
The global memory spaces reserved for the internal resources (RAM, Data FLASH, and FLASH) are not
determined by the MMC module. Size of the individual internal resources are however fixed in the design
of the device cannot be changed by the user. Please refer to the SoC Guide for further details.
and
spaces have fixed top addresses.
144
Table 3-10
Bit22
Bit22
Implemented Memory Map
show the memory spaces occupied by the on-chip resources. Please note that the memory
BDMGPR Register [6:0]
BDMGPR Register [6:0]
1
2
3
RAMSIZE is the hexadecimal value of RAM SIZE in Bytes
DFLASHSIZE is the hexadecimal value of DFLASH SIZE in Bytes
FLASHSIZE is the hexadecimal value of FLASH SIZE in Bytes
Internal Resource
Data FLASH
FLASH
RAM
Table 3-10. Global Implemented Memory Space
Figure 3-18. BDMGPR Address Mapping
S12XS Family Reference Manual, Rev. 1.11
BDM HARDWARE COMMAND
BDM FIRMWARE COMMAND
Global Address [22:0]
Global Address [22:0]
Bit16
Bit16
FLASH_LOW = 0x80_0000 minus FLASHSIZE
DF_HIGH = 0x10_0000 plus DFLASHSIZE
RAM_LOW = 0x10_0000 minus RAMSIZE
Bit15
Bit15
$Address
BDM Local Address
CPU Local Address
1
2
Freescale Semiconductor
3
Figure 3-19
Bit0
Bit0