S912XET512J3VALR Freescale Semiconductor, S912XET512J3VALR Datasheet - Page 62

• Manufacturer Part Number: S912XET512J3VALR
• Description: 16-bit Microcontrollers - MCU 16 BIT,512K FLASH
• Manufacturer: Freescale Semiconductor

Specifications of S912XET512J3VALR

• Rohs: yes
• Core: HCS12X
• Processor Series: MC9S12XE
• Data Bus Width: 16 bit
• Maximum Clock Frequency: 50 MHz
• Program Memory Size: 512 KB
• Data Ram Size: 32 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 3.13 V to 5.5 V
• Operating Temperature Range: - 40 C to + 105 C
• Package / Case: LQFP-112
• Mounting Style: SMD/SMT

Chapter 1 Device Overview MC9S12XE-Family
1.2.3
1.2.3.1
EXTAL and XTAL are the crystal driver and external clock pins. On reset all the device clocks are derived
from the EXTAL input frequency. XTAL is the oscillator output.
1.2.3.2
The RESET pin is an active low bidirectional control signal. It acts as an input to initialize the MCU to a
known start-up state. As an output it is driven low to indicate when any internal MCU reset source triggers.
The RESET pin has an internal pull-up device.
1.2.3.3
This input only pin is reserved for test. This pin has a pull-down device.
1.2.3.4
The BKGD/MODC pin is used as a pseudo-open-drain pin for the background debug communication. It
is used as a MCU operating mode select pin during reset. The state of this pin is latched to the MODC bit
at the rising edge of RESET. The BKGD pin has a pull-up device.
1.2.3.5
PAD[15:0] are general-purpose input or output pins and analog inputs AN[15:0] of the analog-to-digital
converter ATD0.
1.2.3.6
PAD[31:16] are general-purpose input or output pins and analog inputs AN[31:16] of the analog-to-digital
converter ATD1.
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Detailed Signal Descriptions
EXTAL, XTAL — Oscillator Pins
RESET — External Reset Pin
TEST — Test Pin
BKGD / MODC — Background Debug and Mode Pin
PAD[15:0] / AN[15:0] — Port AD Input Pins of ATD0
PAD[31:16] / AN[31:16] — Port AD Input Pins of ATD1
The pin list of the largest package version of each MC9S12XE-Family
derivative gives the complete of interface signals that also exist on smaller
package options, although some of them are not bonded out. For devices
assembled in smaller packages all non-bonded out pins should be
configured as outputs after reset in order to avoid current drawn from
floating inputs. Refer to
drawn to Port R, which does not have enabled pull-up/pull-down devices
coming out of reset.
The TEST pin must be tied to V
MC9S12XE-Family Reference Manual Rev. 1.25
Table 1-10
SS
NOTE
NOTE
in all applications.
for affected pins. Particular attention is
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