S912XET512J3VALR Freescale Semiconductor, S912XET512J3VALR Datasheet - Page 1209

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S912XET512J3VALR

Manufacturer Part Number
S912XET512J3VALR
Description
16-bit Microcontrollers - MCU 16 BIT,512K FLASH
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of S912XET512J3VALR

Rohs
yes
Core
HCS12X
Processor Series
MC9S12XE
Data Bus Width
16 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
512 KB
Data Ram Size
32 KB
On-chip Adc
Yes
Operating Supply Voltage
3.13 V to 5.5 V
Operating Temperature Range
- 40 C to + 105 C
Package / Case
LQFP-112
Mounting Style
SMD/SMT

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
S912XET512J3VALR
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
A.1.9
Freescale Semiconductor
1. The values for thermal resistance are achieved by package simulations for the 9S12XEQ512 die.
2. Junction to case thermal resistance was simulated to be equivalent to the measured values using the cold plate technique
3. Thermal characterization parameter Ψ
Num
11a
11b
12a
12b
1a
1b
2a
2b
6a
6b
7a
7b
10
13
14
15
with the cold plate temperature used as the “case” temperature. This basic cold plate measurement technique is described
by MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when the
package is being used with a heat sink.
case as defined in JESD51-2. Ψ
enviroment.
3
4
5
8
9
C
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
Thermal resistance single sided PCB, natural convection
Thermal resistance single sided PCB @ 200 ft/min
Thermal resistance double sided PCB
with 2 internal planes, natural convection
Thermal resistance double sided PCB
with 2 internal planes @ 200 ft/min
Junction to Board LQFP 144
Junction to Case LQFP 144
Junction to Package Top LQFP144
Thermal resistance single sided PCB, natural convection
Thermal resistance single sided PCB @ 200 ft/min
Thermal resistance double sided PCB
with 2 internal planes, natural convection
Thermal resistance double sided PCB
with 2 internal planes @ 200 ft/min
Junction to Board LQFP112
Junction to Case LQFP112
Junction to Package Top LQFP112
Thermal resistance single sided PCB, natural convection
Thermal resistance single sided PCB @ 200 ft/min
Thermal resistance double sided PCB
with 2 internal planes, natural convection
Thermal resistance double sided PCB
with 2 internal planes @ 200 ft/min
Junction to Board QFP 80
Junction to Case QFP 80
Junction to Package Top QFP 80
I/O Characteristics
Table A-6. Thermal Package Characteristics (9S12XEQ512)
JT
is a useful value to use to estimate junction temperature in a steady state customer
MC9S12XE-Family Reference Manual Rev. 1.25
(2)
Rating
2.
JT
2.
is the “resistance” from junction to reference point thermocouple on top center of the
(3)
3
3
LQFP144
LQFP112
QFP80
Symbol
Ψ
Ψ
Ψ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
JC
JC
JC
JA
JA
JA
JA
JB
JA
JA
JA
JA
JB
JA
JA
JA
JA
JB
JT
JT
JT
Min
Appendix A Electrical Characteristics
(1)
Typ
Max
49
40
40
34
28
50
40
40
34
28
50
40
37
31
23
13
9
2
9
2
3
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
1209

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