AT91SAM7S32-AI ATMEL [ATMEL Corporation], AT91SAM7S32-AI Datasheet - Page 428

• Manufacturer Part Number: AT91SAM7S32-AI
• Description: AT91 ARM Thumb-based Microcontrollers
• Manufacturer: ATMEL [ATMEL Corporation]

Soldering
Profile
428
AT91SAM7S32 Preliminary
Table 107 gives the recommended soldering profile from J-STD-20.
Table 107. Soldering Profile
Small packages may be subject to higher temperatures if they are reflowed in boards with
larger components. In this case, small packages may have to withstand temperatures of up to
235 C, not 220 C (IR reflow).
Recommended package reflow conditions depend on package thickness and volume. See
Table 108.
Table 108. Recommended Package Reflow Conditions
When certain small thin packages are used on boards without larger packages, these small
packages may be classified at 220°C instead of 235°C.
Notes:
A maximum of three reflow passes is allowed per component.
Average Ramp-up Rate (183 C to Peak)
Preheat Temperature 125 C ±25 C
Temperature Maintained Above 183 C
Time within 5 C of Actual Peak Temperature
Peak Temperature Range
Ramp-down Rate
Time 25 C to Peak Temperature
Parameter
Convection
VPR
IR/Convection
2. By default, the package level 1 is qualified at 220 C (unless 235 C is stipulated).
3. The body temperature is the most important parameter but other profile parameters such as
1. The packages are qualified by Atmel by using IR reflow conditions, not convection or VPR.
total exposure time to hot temperature or heating rate may also influence component
reliability.
Convection or
IR/Convection
3 C/sec. max.
120 sec. max
60 sec. to 150 sec.
10 sec. to 20 sec.
220 +5/-0 C or
235 +5/-0 C
6 C/sec.
6 min. max
Temperature
235 +5/-0 C
235 +5/-0 C
235 +5/-0 C
(1, 2, 3)
VPR
10 C/sec.
60 sec.
215 to 219 C or
235 +5/-0 C
10 C/sec.
6071A–ATARM–28-Oct-04