EVX10AS150ATP ETC-unknow, EVX10AS150ATP Datasheet - Page 64

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EVX10AS150ATP

Manufacturer Part Number
EVX10AS150ATP
Description
Adc Single 2.5gsps 10-bit Lvds 317-pin Ebga
Manufacturer
ETC-unknow
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
EVX10AS150ATP
Manufacturer:
E2V
Quantity:
20 000
EV10AS150A
6.4
7. Ordering Information
Table 7-1.
64
EV10AS150ATP-EB
EV10AS150ACTPY
EV10AS150AVTPY
EV10AS150ACTP
EVX10AS150ATP
EV10AS150AVTP
Part Number
Moisture Characteristics
0954B–BDC–12/09
Ordering Information
This device is sensitive to the moisture (MSL3 according to JEDEC standard). Its shelf life in sealed bag
is 12 months at < 40°C and < 90% relative humidity (RH).
Once the bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equiva-
lent processing (peak package body temp. 260°C for ROHS versions and 220°C for non ROHS
versions) must be:
Before mounting, devices will require baking if the humidity indicator is > 20% when read at 23°C ± 5°C.
If baking is required, devices may be baked for:
• Mounted within 168 hours at factory conditions of ≤ 30°C/60% RH, or
• Stored at ≤ 20% RH
• 192 hours at 40°C + 5°C/–0°C and < 5% RH for low-temperature device containers, or
• 24 hours at 125°C ± 5°C for high-temperature device containers
EBGA317
EBGA317
EBGA317
EBGA317
EBGA317
EBGA317
Package
RoHS
RoHS
–40°C < T
–40°C < T
0°C < T
0°C < T
Commercial grade
Commercial grade
Industrial grade
Industrial grade
Temperature
Ambient
Ambient
amb
amb
amb
amb
; T
; T
; T
; T
J
J
J
J
< 90°C
< 90°C
< 110°C
< 110°C
Screening
Prototype
Prototype
Standard
Standard
Standard
Standard
e2v semiconductors SAS 2009
prototype in EBGA317
Evaluation Board with
Production version
Production version
Production version
Production version
EVX10AS150ATP
Comments
soldered
package

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