EVX10AS150ATP ETC-unknow, EVX10AS150ATP Datasheet - Page 63

• Manufacturer Part Number: EVX10AS150ATP
• Description: Adc Single 2.5gsps 10-bit Lvds 317-pin Ebga
• Manufacturer: ETC-unknow

6.3
6.3.1
e2v semiconductors SAS 2009
Thermal Characteristics
Thermal Management Recommendations
As there is no JEDEC standard definition for the thermal resistance applied to a multi-die device, only
the thermal resistance for each die (ADC block powered ON only or DMUX block powered ON only) is
provided.
All results were computed with ANSYS thermal simulation tool and with the following assumptions:
Table 6-1.
Note:
In still air and 25°C ambient temperature conditions, the maximum temperature of 106°C + 25°C =
131°C is reached for the ADC block. It is consequently necessary to manage heat from the EV10AS150
very carefully to avoid permanent damages of the device due to over temperature operation.
In no air cooling conditions, an external heatsink must be placed on top of package. An electrical isola-
tion may be necessary as the TOP of the package is at ground potential.
It is advised to use an external heatsink with intrinsic thermal resistance better than 4°C/Watt when using
air at room temperature 20–25°C. At 60°C, the external heatsink should have an intrinsic thermal resis-
tance better than 3°C/Watt.
Figure 6-3.
• Half geometry simulation
• ADC heating zone = 1.9 × 1.9 mm
• MUX heating 4.0 × 4.0 mm
• No air, pure conduction, no radiation
DMUX block ON only
ADC block ON only
1. Assumed board size = 53 × 43 mm².
Thermal conductive foil
both sides
35 x 35 x 18 heat sink
Thermal Resistor
EV10AS150A-EB Evaluation Board Heat Sink Outlines
2
Rth junction to
bottom of balls
3.9°C/W
7°C/W
2
Rth junction to
Top of Case
4.1°C/W
1.5°C/W
Rth junction to
4.9°C/W
Board
8°C/W
(1)
EV10AS150A
0954B–BDC–12/09
Rth junction to
17.1°C/W
13.9°C/W
ambient
63