LSISASX12 LSI, LSISASX12 Datasheet - Page 27

• Manufacturer Part Number: LSISASX12
• Manufacturer: LSI

Specifications of LSISASX12

• Lead Free Status / Rohs Status: Not Compliant

2.1.4
STP Target Enclosure Management Bridge
The SMP application layer is responsible for processing SMP commands.
This layer implements the mandatory commands as the SAS standard
requires, as well as several vendor-specific SMP commands. These
commands are documented in
Application Layer Commands,” on page
The STP target enclosure management bridge (STP EMB) is an STP to
I
processor. This block transports STP packets between the LSISASx12
expander and the optional external enclosure management processor.
The STP EMB supports connection management to the external
enclosure management processor, consisting of doorbell communication
and data transfer functions.
The EMB_SCL and EMB_SD signals provide the clock and data
interface. Two additional signals, EMB_DB_INT and EMB_CRC_INT
provide the doorbell and CRC error handshaking to external enclosure
processors. The STP also uses the ISTWI_ADDR[1:0] signals to
communicate.
page 2-28
Block Diagram Description
Copyright © 2004, 2005 by LSI Logic Corporation. All rights reserved.
2
C bridge that allows communication with an enclosure management
Transmitting OPEN_ACCEPT in response to OAFs which are not
covered by the previous two bullet items
Receiving SMP Request Frames
CRC checking on SMP Request Frames
Validating fields within SMP Request Frames
Processing mandatory SMP functions
Processing vendor-specific SMP functions
Generating SMP response data
Generating CRC for SMP Response Frames
Transmitting SMP Response Frames
provides more information on the STP EMB interface.
Section 2.7, “STP Enclosure Management Interface,” on
Section 2.4, “Vendor-Specific SMP
2-12.
2-5