TSI148-133CL IDT, Integrated Device Technology Inc, TSI148-133CL Datasheet - Page 388
![no-image](/images/manufacturer_photos/0/3/324/idt__integrated_device_technology_inc_sml.jpg)
TSI148-133CL
Manufacturer Part Number
TSI148-133CL
Description
IC PCI-VME BRIDGE 456PBGA
Manufacturer
IDT, Integrated Device Technology Inc
Series
Tsi148&Trade;r
Datasheets
1.TSI148-133CL.pdf
(391 pages)
2.TSI148-133CL.pdf
(2 pages)
3.TSI148-133CL.pdf
(12 pages)
Specifications of TSI148-133CL
Applications
PCI-to-VME Bridge
Interface
PCI
Voltage - Supply
3.3V
Package / Case
456-PBGA
Mounting Type
Surface Mount
Package Type
BGA
Rad Hardened
No
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
800-1906
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TSI148-133CL
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
Company:
Part Number:
TSI148-133CLY
Manufacturer:
TUNDRA
Quantity:
355
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D. Ordering Information > Part Numbering
D.2
388
Part Numbering
The part numbering system is explained as follows.
•
•
•
•
•
•
Tsi NNN(N) - SS(S) E P G (Z#)
( ) – Indicates optional characters.
Tsi – IDT system interconnect product identifier.
NNNN – Product number (may be three or four digits).
SS(S) – Maximum operating frequency or data transfer rate of the fastest interface. For
operating frequency numbers, M and G represent MHz and GHz. For transfer rate
numbers, M and G represent Mbps and Gbps.
E – Operating environment in which the product is guaranteed. This code may be one of
the following characters:
— C - Commercial temperature range (0 to +70°C)
— I - Industrial temperature range (-40 to +85°C)
— E - Extended temperature range (-55 to +125°C)
P – The Package type of the product:
— B - Ceramic ball grid array (CBGA)
— E, L, J, and K - Plastic ball grid array (PBGA)
— G - Ceramic pin grid array (CPGA)
— M - Small outline integrated circuit (SOIC)
— Q - Plastic quad flatpack (QFP)
Tsi148 PCI/X-to-VME Bus Bridge User Manual
80A3020_MA001_13
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