TSI148-133CL IDT, Integrated Device Technology Inc, TSI148-133CL Datasheet - Page 187
![no-image](/images/manufacturer_photos/0/3/324/idt__integrated_device_technology_inc_sml.jpg)
TSI148-133CL
Manufacturer Part Number
TSI148-133CL
Description
IC PCI-VME BRIDGE 456PBGA
Manufacturer
IDT, Integrated Device Technology Inc
Series
Tsi148&Trade;r
Datasheets
1.TSI148-133CL.pdf
(391 pages)
2.TSI148-133CL.pdf
(2 pages)
3.TSI148-133CL.pdf
(12 pages)
Specifications of TSI148-133CL
Applications
PCI-to-VME Bridge
Interface
PCI
Voltage - Supply
3.3V
Package / Case
456-PBGA
Mounting Type
Surface Mount
Package Type
BGA
Rad Hardened
No
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
800-1906
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TSI148-133CL
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
Company:
Part Number:
TSI148-133CLY
Manufacturer:
TUNDRA
Quantity:
355
- Current page: 187 of 391
- Download datasheet (2Mb)
9.4.2
Tsi148 PCI/X-to-VME Bus Bridge User Manual
80A3020_MA001_13
Table 31
according to the number of layers on the PCB.
Table 31: 456 EPBGA Package Thermal Performance for an 8 layer PCB
Table 32: 456 EPBGA Package Thermal Performance for a 4 layer PCB
Junction-to-Board and Junction-to-Case Characteristics
Table 33
package.
Table 33: Thermal Characteristics of Tsi148
Theta jb (junction-to-board)
Theta jc (junction-to-case)
Air Flow (m/s)
Air Flow (m/s)
shows the simulated Thetajb and Theta jc thermal characteristics of the Tsi148
and
Interface
0
1
2
0
1
2
Table 32
show the package thermal performance for the Tsi148 device
Power Consumption (W)
Power Consumption (W)
1.84
1.84
1.84
1.84
1.84
1.84
9. Electrical Characteristics > Thermal Characteristics
16.6
10.3
Result
Theta ja (°C/W)
C/watt
C/watt
Theta ja (°C/W)
21.5
18.0
16.8
16.1
15.1
19
187
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