TSI148-133CL IDT, Integrated Device Technology Inc, TSI148-133CL Datasheet - Page 187

• Manufacturer Part Number: TSI148-133CL
• Description: IC PCI-VME BRIDGE 456PBGA
• Manufacturer: IDT, Integrated Device Technology Inc
• Series: Tsi148&Trade;r

Specifications of TSI148-133CL

• Applications: PCI-to-VME Bridge
• Interface: PCI
• Voltage - Supply: 3.3V
• Package / Case: 456-PBGA
• Mounting Type: Surface Mount
• Package Type: BGA
• Rad Hardened: No
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 800-1906

9.4.2
Tsi148 PCI/X-to-VME Bus Bridge User Manual
80A3020_MA001_13
Table 31
according to the number of layers on the PCB.
Table 31: 456 EPBGA Package Thermal Performance for an 8 layer PCB
Table 32: 456 EPBGA Package Thermal Performance for a 4 layer PCB
Junction-to-Board and Junction-to-Case Characteristics
Table 33
package.
Table 33: Thermal Characteristics of Tsi148
Theta jb (junction-to-board)
Theta jc (junction-to-case)
Air Flow (m/s)
Air Flow (m/s)
shows the simulated Thetajb and Theta jc thermal characteristics of the Tsi148
and
Interface
0
1
2
0
1
2
Table 32
show the package thermal performance for the Tsi148 device
Power Consumption (W)
Power Consumption (W)
1.84
1.84
1.84
1.84
1.84
1.84
9. Electrical Characteristics > Thermal Characteristics
16.6
10.3
Result


Theta ja (°C/W)
C/watt
C/watt
Theta ja (°C/W)
21.5
18.0
16.8
16.1
15.1
19
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