TSI148-133CL IDT, Integrated Device Technology Inc, TSI148-133CL Datasheet - Page 186
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TSI148-133CL
Manufacturer Part Number
TSI148-133CL
Description
IC PCI-VME BRIDGE 456PBGA
Manufacturer
IDT, Integrated Device Technology Inc
Series
Tsi148&Trade;r
Datasheets
1.TSI148-133CL.pdf
(391 pages)
2.TSI148-133CL.pdf
(2 pages)
3.TSI148-133CL.pdf
(12 pages)
Specifications of TSI148-133CL
Applications
PCI-to-VME Bridge
Interface
PCI
Voltage - Supply
3.3V
Package / Case
456-PBGA
Mounting Type
Surface Mount
Package Type
BGA
Rad Hardened
No
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
800-1906
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TSI148-133CL
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
Company:
Part Number:
TSI148-133CLY
Manufacturer:
TUNDRA
Quantity:
355
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9. Electrical Characteristics > Thermal Characteristics
9.4
9.4.1
186
Table 30
determined by subtracting the Total Core Logic Power from the Total Power Dissipation.
Table 30: Tsi148 Power Dissipation Division
Thermal Characteristics
Based on the worst case die power dissipation of 1.84W the Tsi148’s thermal performance
does meet the industrial grade requirements. These results are based on the Tsi148 being
routed on an 8 layer PCB. It should be noted that the thermal simulations for a JEDEC
standard 4 layer PCB with a worst case power dissipation of 1.84W, the Tsi148 does not have
sufficient thermal performance to meet the industrial grade requirements. If the worst case die
power dissipation is less than or equal to 1.7W, the Tsi148 does have sufficient thermal
performance to meet the industrial grade requirements when routed on a 4 layer PCB.
The maximum ambient temperature of the Tsi148 can be calculated as follows:
Ta <= Tj - Theta ja * P
Where,
Ta = Ambient temperature ( °C )
Tj = Maximum Tsi148 Junction temperature (°C) = 122°C
Theta ja = Ambient to Junction Thermal Impedance ( °C /Watt)
P = Tsi148 power consumption (Watts)
Junction-to-Ambient Thermal Characteristics (Theta ja)
The junction-to-ambient thermal impedance (Theta ja) is dependent on the air flow in
meters per second over the Tsi148.
Total Core Logic Power
shows how the power dissipation is divided in the Tsi148. The IO portion can be
PLL Power
Source
(“Power Consumption” on page
Nominal (W)
1.322
0.030
Tsi148 PCI/X-to-VME Bus Bridge User Manual
185).
80A3020_MA001_13
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