TSI148-133CL IDT, Integrated Device Technology Inc, TSI148-133CL Datasheet - Page 137
![no-image](/images/manufacturer_photos/0/3/324/idt__integrated_device_technology_inc_sml.jpg)
TSI148-133CL
Manufacturer Part Number
TSI148-133CL
Description
IC PCI-VME BRIDGE 456PBGA
Manufacturer
IDT, Integrated Device Technology Inc
Series
Tsi148&Trade;r
Datasheets
1.TSI148-133CL.pdf
(391 pages)
2.TSI148-133CL.pdf
(2 pages)
3.TSI148-133CL.pdf
(12 pages)
Specifications of TSI148-133CL
Applications
PCI-to-VME Bridge
Interface
PCI
Voltage - Supply
3.3V
Package / Case
456-PBGA
Mounting Type
Surface Mount
Package Type
BGA
Rad Hardened
No
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
800-1906
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TSI148-133CL
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
Company:
Part Number:
TSI148-133CLY
Manufacturer:
TUNDRA
Quantity:
355
- Current page: 137 of 391
- Download datasheet (2Mb)
Tsi148 PCI/X-to-VME Bus Bridge User Manual
80A3020_MA001_13
7. JTAG Module
The Joint Test Action Group (JTAG) created the boundary-scan testing standard (documented
in the IEEE 1149.1 Standard) for testing printed circuit boards (PCBs). The boundary-scan
approach involves designing boundary-scan circuitry into the integrated circuit. PCBs
populated with 1149.1 compliant devices can be tested for connectivity, correct device
orientation, correct device location, and device identification.
All the pins on compliant devices can be controlled and observed using (typically) five pins
that are routed to the board edge connector. Board designers can develop a standard test for all
1149.1 compliant devices regardless of device manufacturer, package type, technology, or
device speed.
This chapter discusses the following topics about Tsi148’s JTAG features:
•
•
“Overview of JTAG” on page 138
“Instructions” on page 138
137
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