STM32W108HBU61TR STMicroelectronics, STM32W108HBU61TR Datasheet - Page 52

• Manufacturer Part Number: STM32W108HBU61TR
• Description: 16/32-BITS MICROS
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32W108HBU61TR

• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Applications: IEEE 802.15.4 Wireless
• Processing Unit: Microprocessor
• Operating Supply Voltage (min): 1.18V
• Operating Supply Voltage (typ): 1.25V
• Operating Supply Voltage (max): 1.32V
• Package Type: VFQFPN EP
• Pin Count: 40
• Mounting: Surface Mount
• Rad Hardened: No
• Core Processor: ARM® Cortex-M3™
• Program Memory Type: FLASH (128 kB)
• Controller Series: STM32W
• Ram Size: 8K x 8
• Interface: I²C, SPI, UART/USART
• Number Of I /o: 18
• Voltage - Supply: 1.18 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 40-VFQFN Exposed Pad
• Lead Free Status / Rohs Status: Compliant

System modules
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The following source is only available in deep sleep 0 since the SWJ is required to write
memory to set this wake source and the SWJ only has access to some registers in deep
sleep 0.
●
The Wakeup Recording module monitors all possible wakeup sources. More than one
wakeup source may be recorded because events are continually being recorded (not just in
deep-sleep), since another event may happen between the first wake event and when the
STM32W108 wakes up.
Wake on write to the WAKE_CORE register bit.
STM32W108HB, STM32W108CC, STM32W108CB and STM32W108CZ
Doc ID 16252 Rev 9