M306N4FGTFP#U0 Renesas Electronics America, M306N4FGTFP#U0 Datasheet - Page 16

• Manufacturer Part Number: M306N4FGTFP#U0
• Description: MCU 5V 256K T-TEMP PB-FREE 100-Q
• Manufacturer: Renesas Electronics America
• Series: M16C™ M16C/6Nr

Specifications of M306N4FGTFP#U0

• Core Processor: M16C/60
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: CAN, I²C, IEBus, SIO, UART/USART
• Peripherals: DMA, WDT
• Number Of I /o: 85
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 10K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 26x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-QFP
• For Use With: R0K3306NKS001BE - KIT DEV RSK RSK-M16C/6NKR0K3306NKS000BE - KIT DEV RSK RSK-M16C/6NK
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Appendix 1. Package Dimensions ........................................................................................ 374
Register Index ....................................................................................................................... 375
23.7 DMAC .................................................................................................................................................... 351
23.8 Timers .................................................................................................................................................... 352
23.9 Serial Interface ....................................................................................................................................... 357
23.10 A/D Converter ...................................................................................................................................... 360
23.11 CAN Module ......................................................................................................................................... 362
23.12 Programmable I/O Ports ...................................................................................................................... 367
23.13 Electrical Characteristic Differences between Mask ROM and Flash Memory Version MCUs ............ 368
23.14 Mask ROM Version .............................................................................................................................. 369
23.15 Flash Memory Version ......................................................................................................................... 370
23.16 Flash Memory Programming Using Boot Program .............................................................................. 372
23.17 Noise .................................................................................................................................................... 373
Specifications written in this manual are believed to be accurate, but are not guaranteed to be entirely free
of error. Specifications in this manual may be changed for functional or performance improvements.
Please make sure your manual is the latest edition.
23.7.1 Write to DMAE Bit in DMiCON Register ........................................................................................ 351
23.8.1 Timer A ........................................................................................................................................... 352
23.8.2 Timer B ........................................................................................................................................... 355
23.9.1 Clock Synchronous Serial I/O Mode .............................................................................................. 357
23.9.2 Special Modes ............................................................................................................................... 358
23.9.3 SI/O3 .............................................................................................................................................. 359
23.11.1 Reading CiSTR Register .............................................................................................................. 362
23.11.2 Performing CAN Configuration ..................................................................................................... 364
23.11.3 Suggestions to Reduce Power Consumption ............................................................................... 365
23.11.4 CAN Transceiver in Boot Mode .................................................................................................... 366
23.15.1 Functions to Prevent Flash Memory from Rewriting .................................................................... 370
23.15.2 Stop Mode .................................................................................................................................... 370
23.15.3 Wait Mode .................................................................................................................................... 370
23.15.4 Low Power Dissipation Mode and On-Chip Oscillator Low Power Dissipation Mode ................. 370
23.15.5 Writing Command and Data ......................................................................................................... 370
23.15.6 Program Command ...................................................................................................................... 370
23.15.7 Lock Bit Program Command ........................................................................................................ 370
23.15.8 Operating Speed .......................................................................................................................... 370
23.15.9 Prohibited Instructions ................................................................................................................. 371
23.15.10 Interrupts .................................................................................................................................... 371
23.15.11 How to Access ............................................................................................................................ 371
23.15.12 Rewriting in User ROM Area ...................................................................................................... 371
23.15.13 DMA Transfer ............................................................................................................................. 371
23.16.1 Programming Using Serial I/O Mode ........................................................................................... 372
23.16.2 Programming Using CAN I/O Mode ............................................................................................. 372
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