ATSAM3S4CA-AU Atmel, ATSAM3S4CA-AU Datasheet - Page 816

IC MCU 32BIT 256KB FLASH 100LQFP

ATSAM3S4CA-AU

Manufacturer Part Number
ATSAM3S4CA-AU
Description
IC MCU 32BIT 256KB FLASH 100LQFP
Manufacturer
Atmel
Series
SAM3Sr
Datasheets

Specifications of ATSAM3S4CA-AU

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
64MHz
Connectivity
EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
79
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
1.62 V ~ 1.95 V
Data Converters
A/D 16x10/12b, D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Controller Family/series
ATSAM3S
No. Of I/o's
79
Ram Memory Size
48KB
Cpu Speed
64MHz
No. Of Timers
6
Rohs Compliant
Yes
Processor Series
ATSAM3x
Core
ARM Cortex M3
3rd Party Development Tools
JTRACE-CM3, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
ATSAM3S-EK
Cpu Family
AT91
Device Core
ARM Cortex-M3
Device Core Size
32b
Frequency (max)
64MHz
Total Internal Ram Size
48KB
# I/os (max)
79
Number Of Timers - General Purpose
6
Operating Supply Voltage (typ)
1.8/3.3V
Operating Supply Voltage (max)
1.95/3.6V
Operating Supply Voltage (min)
1.62V
On-chip Adc
16-chx12-bit
On-chip Dac
2-chx12-bit
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
100
Package Type
LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ATSAM3S4CA-AU
Manufacturer:
Atmel
Quantity:
10 000
Part Number:
ATSAM3S4CA-AU
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
Part Number:
ATSAM3S4CA-AUR
Manufacturer:
Atmel
Quantity:
10 000
35.14.2
Name:
Address:
Access:
This register can only be written if the WPEN bit is cleared in
• CLKDIV: Clock Divider
High Speed MultiMedia Card Interface clock (MCCK or HSMCI_CK) is Master Clock (MCK) divided by (2*(CLKDIV+1)).
• PWSDIV: Power Saving Divider
High Speed MultiMedia Card Interface clock is divided by 2
Warning: This value must be different from 0 before enabling the Power Save Mode in the HSMCI_CR (HSMCI_PWSEN
bit).
• RDPROOF Read Proof Enable
Enabling Read Proof allows to stop the HSMCI Clock during read access if the internal FIFO is full. This will guarantee data
integrity, not bandwidth.
0 = Disables Read Proof.
1 = Enables Read Proof.
• WRPROOF Write Proof Enable
Enabling Write Proof allows to stop the HSMCI Clock during write access if the internal FIFO is full. This will guarantee data
integrity, not bandwidth.
0 = Disables Write Proof.
1 = Enables Write Proof.
• FBYTE: Force Byte Transfer
Enabling Force Byte Transfer allow byte transfers, so that transfer of blocks with a size different from modulo 4 can be
supported.
Warning: BLKLEN value depends on FBYTE.
0 = Disables Force Byte Transfer.
1 = Enables Force Byte Transfer.
816
PDCMODE
31
23
15
7
SAM3S Preliminary
HSMCI Mode Register
PADV
30
22
14
HSMCI_MR
0x40000004
Read-write
6
FBYTE
29
21
13
5
WRPROOF
28
20
12
4
BLKLEN
BLKLEN
CLKDIV
(PWSDIV)
“HSMCI Write Protect Mode Register” on page
RDPROOF
+ 1 when entering Power Saving Mode.
27
19
11
3
26
18
10
2
PWSDIV
25
17
9
1
6500C–ATARM–8-Feb-11
840.
24
16
8
0

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