ATSAM3S4CA-AU Atmel, ATSAM3S4CA-AU Datasheet - Page 799

• Manufacturer Part Number: ATSAM3S4CA-AU
• Description: IC MCU 32BIT 256KB FLASH 100LQFP
• Manufacturer: Atmel
• Series: SAM3Sr

Specifications of ATSAM3S4CA-AU

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 79
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.62 V ~ 1.95 V
• Data Converters: A/D 16x10/12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Controller Family/series: ATSAM3S
• No. Of I/o's: 79
• Ram Memory Size: 48KB
• Cpu Speed: 64MHz
• No. Of Timers: 6
• Rohs Compliant: Yes
• Processor Series: ATSAM3x
• Core: ARM Cortex M3
• 3rd Party Development Tools: JTRACE-CM3, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ATSAM3S-EK
• Cpu Family: AT91
• Device Core: ARM Cortex-M3
• Device Core Size: 32b
• Frequency (max): 64MHz
• Total Internal Ram Size: 48KB
• # I/os (max): 79
• Number Of Timers - General Purpose: 6
• Operating Supply Voltage (typ): 1.8/3.3V
• Operating Supply Voltage (max): 1.95/3.6V
• Operating Supply Voltage (min): 1.62V
• On-chip Adc: 16-chx12-bit
• On-chip Dac: 2-chx12-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

6500C–ATARM–8-Feb-11
The High Speed MultiMedia Card communication is based on a 13-pin serial bus interface. It has
three communication lines and four supply lines.
Table 35-4.
Notes:
Figure 35-4. MMC Bus Connections (One Slot)
Note:
Pin
Number
1
2
3
4
5
6
7
8
9
10
11
12
13
2. When several HSMCI (x HSMCI) are embedded in a product, MCCK refers to HSMCIx_CK,
When several HSMCI (x HSMCI) are embedded in a product, MCCK refers to HSMCIx_CK,
MCCDA to HSMCIx_CDA MCDAy to HSMCIx_DAy.
1. I: Input, O: Output, PP: Push/Pull, OD: Open Drain.
MCCDA to HSMCIx_CDA, MCDAy to HSMCIx_DAy.
HSMCI
Bus Topology
MCCDA
MCCK
MCDA0
Name
DAT[3]
CMD
VSS1
VDD
CLK
VSS2
DAT[0]
DAT[1]
DAT[2]
DAT[4]
DAT[5]
DAT[6]
DAT[7]
Type
I/O/PP
I/O/PP/OD
S
S
I/O
S
I/O/PP
I/O/PP
I/O/PP
I/O/PP
I/O/PP
I/O/PP
I/O/PP
1
9 1011
2 3 4 5 6
(1)
MMC1
1213 8
7
Description
Data
Command/response
Supply voltage ground
Supply voltage
Clock
Supply voltage ground
Data 0
Data 1
Data 2
Data 4
Data 5
Data 6
Data 7
1
9 1011
2 3 4 5 6
MMC2
SAM3S Preliminary
1213 8
7
1
9 1011
2 3 4 5 6
MMC3
MCDz3
VSS
VSS
HSMCI Pin Name
(Slot z)
MCCDz
VDD
MCCK
MCDz0
MCDz1
MCDz2
MCDz4
MCDz5
MCDz6
MCDz7
1213 8
7
799
((2)