ATSAM3S4CA-AU Atmel, ATSAM3S4CA-AU Datasheet - Page 310

• Manufacturer Part Number: ATSAM3S4CA-AU
• Description: IC MCU 32BIT 256KB FLASH 100LQFP
• Manufacturer: Atmel
• Series: SAM3Sr

Specifications of ATSAM3S4CA-AU

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 79
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.62 V ~ 1.95 V
• Data Converters: A/D 16x10/12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Controller Family/series: ATSAM3S
• No. Of I/o's: 79
• Ram Memory Size: 48KB
• Cpu Speed: 64MHz
• No. Of Timers: 6
• Rohs Compliant: Yes
• Processor Series: ATSAM3x
• Core: ARM Cortex M3
• 3rd Party Development Tools: JTRACE-CM3, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ATSAM3S-EK
• Cpu Family: AT91
• Device Core: ARM Cortex-M3
• Device Core Size: 32b
• Frequency (max): 64MHz
• Total Internal Ram Size: 48KB
• # I/os (max): 79
• Number Of Timers - General Purpose: 6
• Operating Supply Voltage (typ): 1.8/3.3V
• Operating Supply Voltage (max): 1.95/3.6V
• Operating Supply Voltage (min): 1.62V
• On-chip Adc: 16-chx12-bit
• On-chip Dac: 2-chx12-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

19.2.3
19.2.4
19.2.4.1
Figure 19-3. SAM3SxB/C (64/100 pins) Parallel Programming Timing, Write Sequence
310
SAM3S Preliminary
Entering Programming Mode
Programmer Handshaking
Write Handshaking
MODE[3:0]
DATA[7:0]
The following algorithm puts the device in Parallel Programming Mode:
Note:
An handshake is defined for read and write operations. When the device is ready to start a new
operation (RDY signal set), the programmer starts the handshake by clearing the NCMD signal.
The handshaking is achieved once NCMD signal is high and RDY is high.
For details on the write handshaking sequence, refer to
NVALID
NCMD
• Apply GND, VDDIO, VDDCORE and VDDPLL.
• Apply XIN clock within T
• Wait for T
• Start a read or write handshaking.
NOE
RDY
1
After reset, the device is clocked by the internal RC oscillator. Before clearing RDY signal, if an
external clock (> 32 kHz) is connected to XIN, then the device switches on the external clock.
Else, XIN input is not considered. A higher frequency on XIN speeds up the programmer
handshake.
POR_RESET
2
3
POR_RESET
if an external clock is available.
4
5
Figure
19-3,
Figure 19-4
6500C–ATARM–8-Feb-11
and
Table
19-4.