ATSAM3S4CA-AU Atmel, ATSAM3S4CA-AU Datasheet - Page 291

• Manufacturer Part Number: ATSAM3S4CA-AU
• Description: IC MCU 32BIT 256KB FLASH 100LQFP
• Manufacturer: Atmel
• Series: SAM3Sr

Specifications of ATSAM3S4CA-AU

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 79
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.62 V ~ 1.95 V
• Data Converters: A/D 16x10/12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Controller Family/series: ATSAM3S
• No. Of I/o's: 79
• Ram Memory Size: 48KB
• Cpu Speed: 64MHz
• No. Of Timers: 6
• Rohs Compliant: Yes
• Processor Series: ATSAM3x
• Core: ARM Cortex M3
• 3rd Party Development Tools: JTRACE-CM3, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ATSAM3S-EK
• Cpu Family: AT91
• Device Core: ARM Cortex-M3
• Device Core Size: 32b
• Frequency (max): 64MHz
• Total Internal Ram Size: 48KB
• # I/os (max): 79
• Number Of Timers - General Purpose: 6
• Operating Supply Voltage (typ): 1.8/3.3V
• Operating Supply Voltage (max): 1.95/3.6V
• Operating Supply Voltage (min): 1.62V
• On-chip Adc: 16-chx12-bit
• On-chip Dac: 2-chx12-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

18. Enhanced Embedded Flash Controller (EEFC)
18.1
18.2
18.2.1
18.2.2
18.3
18.3.1
6500C–ATARM–8-Feb-11
Description
Product Dependencies
Functional Description
Power Management
Interrupt Sources
Embedded Flash Organization
The Enhanced Embedded Flash Controller (EEFC) ensures the interface of the Flash block with
the 32-bit internal bus.
Its 128-bit or 64-bit wide memory interface increases performance. It also manages the pro-
gramming, erasing, locking and unlocking sequences of the Flash using a full set of commands.
One of the commands returns the embedded Flash descriptor definition that informs the system
about the Flash organization, thus making the software generic.
The Enhanced Embedded Flash Controller (EEFC) is continuously clocked. The Power Man-
agement Controller has no effect on its behavior.
The Enhanced Embedded Flash Controller (EEFC) interrupt line is connected to the Nested
Vectored Interrupt Controller (NVIC). Using the Enhanced Embedded Flash Controller (EEFC)
interrupt requires the NVIC to be programmed first. The EEFC interrupt is generated only on
FRDY bit rising.
Table 18-1.
The embedded Flash interfaces directly with the 32-bit internal bus. The embedded Flash is
composed of:
The embedded Flash size, the page size, the lock regions organization and GPNVM bits defini-
tion are described in the product definition section. The Enhanced Embedded Flash Controller
(EEFC) returns a descriptor of the Flash controlled after a get descriptor command issued by the
application (see
• One memory plane organized in several pages of the same size.
• Two 128-bit or 64-bit read buffers used for code read optimization.
• One 128-bit or 64-bit read buffer used for data read optimization.
• One write buffer that manages page programming. The write buffer size is equal to the page
• Several lock bits used to protect write/erase operation on several pages (lock region). A lock
• Several bits that may be set and cleared through the Enhanced Embedded Flash Controller
size. This buffer is write-only and accessible all along the 1 MByte address space, so that
each word can be written to its final address.
bit is associated with a lock region composed of several pages in the memory plane.
(EEFC) interface, called General Purpose Non Volatile Memory bits (GPNVM bits).
Instance
EFC
Peripheral IDs
“Getting Embedded Flash Descriptor” on page
ID
6
SAM3S Preliminary
296).
291