ATSAM3S4CA-AU Atmel, ATSAM3S4CA-AU Datasheet - Page 347
![IC MCU 32BIT 256KB FLASH 100LQFP](/photos/6/76/67646/313-100-lqfp_sml.jpg)
ATSAM3S4CA-AU
Manufacturer Part Number
ATSAM3S4CA-AU
Description
IC MCU 32BIT 256KB FLASH 100LQFP
Manufacturer
Atmel
Series
SAM3Sr
Specifications of ATSAM3S4CA-AU
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
64MHz
Connectivity
EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
79
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
1.62 V ~ 1.95 V
Data Converters
A/D 16x10/12b, D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Controller Family/series
ATSAM3S
No. Of I/o's
79
Ram Memory Size
48KB
Cpu Speed
64MHz
No. Of Timers
6
Rohs Compliant
Yes
Processor Series
ATSAM3x
Core
ARM Cortex M3
3rd Party Development Tools
JTRACE-CM3, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
ATSAM3S-EK
Cpu Family
AT91
Device Core
ARM Cortex-M3
Device Core Size
32b
Frequency (max)
64MHz
Total Internal Ram Size
48KB
# I/os (max)
79
Number Of Timers - General Purpose
6
Operating Supply Voltage (typ)
1.8/3.3V
Operating Supply Voltage (max)
1.95/3.6V
Operating Supply Voltage (min)
1.62V
On-chip Adc
16-chx12-bit
On-chip Dac
2-chx12-bit
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
100
Package Type
LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ATSAM3S4CA-AU
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
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22. Bus Matrix (MATRIX)
22.1
22.2
22.2.1
22.2.2
6500C–ATARM–8-Feb-11
Description
Embedded Characteristics
Matrix Masters
Matrix Slaves
The Bus Matrix implements a multi-layer AHB that enables parallel access paths between multi-
ple AHB masters and slaves in a system, which increases the overall bandwidth. Bus Matrix
interconnects 4 AHB Masters to 5 AHB Slaves. The normal latency to connect a master to a
slave is one cycle except for the default master of the accessed slave which is connected
directly (zero cycle latency).
The Bus Matrix user interface also provides a Chip Configuration User Interface with Registers
that allow to support application specific features.
The Bus Matrix of the SAM3S product manages 4 masters, which means that each master can
perform an access concurrently with others, to an available slave.
Each master has its own decoder, which is defined specifically for each master. In order to sim-
plify the addressing, all the masters have the same decodings.
Table 22-1.
The Bus Matrix of the SAM3S product manages 5 slaves. Each slave has its own arbiter, allow-
ing a different arbitration per slave.
Table 22-2.
Master 0
Master 1
Master 2
Master 3
Slave 0
Slave 1
Slave 2
Slave 3
Slave 4
List of Bus Matrix Masters
List of Bus Matrix Slaves
Internal SRAM
Internal ROM
Internal Flash
External Bus Interface
Peripheral Bridge
Cortex-M3 Instruction/Data
Cortex-M3 System
Peripheral DMA Controller (PDC)
CRC Calculation Unit
SAM3S Preliminary
347
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