XC2V8000-5BF957C Xilinx, Inc., XC2V8000-5BF957C Datasheet - Page 77

• Manufacturer Part Number: XC2V8000-5BF957C
• Description: Virtex-II 1.5V Field-Programmable Gate Array
• Manufacturer: Xilinx, Inc.

DS031-4 (v1.5) April 2, 2001
This document provides
Definitions, followed by pinout tables for the following packages:
•
•
•
•
•
Virtex
Combinations and Maximum I/Os
Available
Wire-bond and flip-chip packages are available.
Table 2
wire-bond and flip-chip packages, respectively.
Table 3
device/package combinations.
Table 1: Wire-Bond Packages Information
Table 2: Flip-Chip Packages Information
DS031-4 (v1.5) April 2, 2001
Advance Product Specification
Pitch (mm)
Size (mm)
I/Os
Pitch (mm)
Size (mm)
I/Os
CS144 Chip-Scale BGA Package
FG256 Fine-Pitch BGA Package
FG456 Fine-Pitch BGA Package
FG676 Fine-Pitch BGA Package
BG575 Standard BGA Package
© 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
Package
Package
show the maximum number of user I/Os possible in
shows the number of user I/Os available for all
®
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
-II Device/Package
Virtex®-II Device/Package Combinations and Maximum I/Os Available
12 x 12
CS144
0.80
R
92
31 x 31
FF896
1.00
624
17 x 17
FG256
1.00
172
Table 1
0
0
www.xilinx.com
1-800-255-7778
and
FF1152
35 x 35
1.00
0
824
23 x 23
FG456
1.00
324
Virtex-II 1.5V
Field-Programmable Gate Arrays
Pinout Information
Advance Product Specification
•
•
•
•
•
•
•
•
•
•
The number of I/Os per package include all user I/Os except
the 15 control pins (CCLK, DONE, M0, M1, M2, PROG_B,
PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN,
DXP, AND RSVD).
BG728 Standard BGA Package
FF896 Flip-Chip Fine-Pitch BGA Package
FF1152 Flip-Chip Fine-Pitch BGA Package
FF1517 Flip-Chip Fine-Pitch BGA Package
BF957 Flip-Chip BGA Package
CS denotes wire-bond chip-scale ball grid array (BGA)
(0.80 mm pitch).
FG denotes wire-bond fine-pitch BGA (1.00 mm pitch).
FF denotes flip-chip fine-pitch BGA (1.00 mm pitch).
BG denotes standard BGA (1.27 mm pitch).
BF denotes flip-chip BGA (1.27 mm pitch).
27 x 27
FG676
1.00
484
FF1517
40 x 40
1,108
1.00
31 x 31
BG575
1.27
408
and
40 x 40
BF957
1.27
684
Virtex-II Pin
Module 4 of 4
35 x 35
BG728
1.27
516
1