S1K50000 Epson Electronics America, Inc., S1K50000 Datasheet - Page 102

• Manufacturer Part Number: S1K50000
• Description: Design Guide S1k50000 Series
• Manufacturer: Epson Electronics America, Inc.

STANDARD CELL S1K50000 SERIES
DESIGN GUIDE
b) Low-noise predrivers
(8) Other precautions
a) NC (non-connected) pins
b) TAB suspended pins
To reduce the amount of noise generated by the output buffers of large-current drivers during
operation, special low-noise output and bidirectional buffers available from Seiko Epson may be
used. For details, see Chapter 3, “Types of Input/Output Buffers and Usage Precautions.”
The relationship between the package pins and LSI pads is predetermined based on the
combination of product types and packages in each series. Therefore, pin usage may be
subject to limitations due to the package, or pin placement may be subject to limitations
due to the input/output buffer types.
Consider the precautions described below before determining the pin arrangement.
If the number of LSI pads is smaller than the number of package pins or the LSI pads
cannot be assembled into the package pins, some package pins cannot be used. These
pins are indicated by “**” in the pin arrangement table.
The TAB suspended pins are the package pins that are connected directly to the LSI
substrate. These pins are at the V
external sources. Normally, leave these pins open when they are mounted on the board.
These pins are indicated by “##” in the pin arrangement table.
Figure 8-9 Example of Power-Supply Enhancement
output
SS
(GND) level without being supplied with power from
EPSON
Chapter 8: Pin Arrangement and Simultaneous Operation
V
High drive
V
SS
SS
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