TXC-06312BIOG Transwitch Corporation, TXC-06312BIOG Datasheet - Page 45

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TXC-06312BIOG

Manufacturer Part Number
TXC-06312BIOG
Description
Manufacturer
Transwitch Corporation
Datasheet

Specifications of TXC-06312BIOG

Lead Free Status / Rohs Status
Supplier Unconfirmed
Notes:
1. Conditions exceeding the Min or Max values may cause permanent failure. Exposure to conditions near the Min or Max
2. Pre-assembly storage in non-drypack conditions is not recommended. Please refer to the instructions on the
3. Test method for ESD per JEDEC JESD22-A114C.01.
4. Device core is 1.8V only.
5. All LVDS and LVPECL inputs, LINERXCAP and LINETXCAP are excluded.
4 5 o f 2 0 2
Thermal resistance - junction to ambient
values for extended periods may impair device reliability.
“CAUTION” label on the drypack bag in which devices are supplied.
Core Supply Voltage, +1.8V
nominal
I/O Supply Voltage, +3.3V
nominal
DC input voltage
Storage temperature range
Ambient operating
temperature
Moisture Exposure Level
Relative humidity, during
assembly
Relative humidity, in-circuit
ESD Classification
Latch-up
7.1 ABSOLUTE MAXIMUM RATINGS AND ENVIRONMENTAL LIMITATIONS
7.2 THERMAL CHARACTERISTICS
Parameter
Parameter
7.0 S
Symbol
V
V
ESD
VIN
- Selected Parameter Values -
ME
RH
RH
LU
T
T
DD1
DD2
S
A
ELECTED
Min
absolute value 2000
Min
-0.3
-0.3
-0.5
-55
-40
30
5
0
Typ
14.7
Max
150
100
5.5
2.1
3.9
85
60
P
Max
ARAMETER
Level
Unit
%
%
V
V
V
V
C
C
PRELIMINARY TXC-06312B-MB, Ed. 2
o
Unit
Notes 1, 4
Notes 1, 4
Notes 1, 4, 5
Note 1
0 ft/min. linear airflow
per IPC/JEDEC J-STD-020C
Note 2
non-condensing
Note 3
Meets JEDEC STD-78
C/W
PHAST-12N Device
0 ft/min linear airflow
Conditions
Test Conditions
V
DATA SHEET
ALUES
TXC-06312B
June 2005

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