XC3S400AN-4FTG256I Xilinx Inc, XC3S400AN-4FTG256I Datasheet - Page 72

• Manufacturer Part Number: XC3S400AN-4FTG256I
• Description: IC FPGA SPARTAN-3AN 256FTBGA
• Manufacturer: Xilinx Inc
• Series: Spartan™-3ANr

Specifications of XC3S400AN-4FTG256I

• Number Of Logic Elements/cells: 8064
• Number Of Labs/clbs: 896
• Total Ram Bits: 368640
• Number Of I /o: 195
• Number Of Gates: 400000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 256-LBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Chapter 7: Power Management
Thermal Considerations
72
Figure 7-1: ISF Memory Enters Standby Mode when CSB is High Longer than 35 μs
The ISF memory has negligible effect on the thermal considerations for the FPGA. The
junction temperature of the ISF memory will be the same as the junction temperature
calculated for the FPGA.
CSB
www.xilinx.com
ISF memory selected
Active Mode
(10 to 15 mA)
Spartan-3AN FPGA In-System Flash User Guide
35 μs
UG333 (v2.1) January 15, 2009
Standby Mode
(100 μA)
UG333_c8_01_082307
R