ST7FOXK1T6 STMicroelectronics, ST7FOXK1T6 Datasheet - Page 201
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ST7FOXK1T6
Manufacturer Part Number
ST7FOXK1T6
Description
IC MCU 8BIT 1V FLASH MEM 32LQFP
Manufacturer
STMicroelectronics
Series
ST7r
Datasheet
1.ST7FOXF1M6.pdf
(226 pages)
Specifications of ST7FOXK1T6
Core Processor
ST7
Core Size
8-Bit
Speed
8MHz
Connectivity
I²C
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
24
Program Memory Size
4KB (4K x 8)
Program Memory Type
FLASH
Ram Size
384 x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
32-LQFP
Processor Series
ST7FOXx
Core
ST7
Data Bus Width
8 bit
Data Ram Size
384 B
Interface Type
I2C
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
24
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
ST7FLITE-SK/RAIS, STX-RLINK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 1 Channel
For Use With
497-5049 - KIT STARTER RAISONANCE ST7FLITE
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
497-6336
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ST7FOXK1T6
Manufacturer:
STMicroelectronics
Quantity:
10 000
Company:
Part Number:
ST7FOXK1T6TR
Manufacturer:
STMicroelectronics
Quantity:
10 000
ST7FOXF1, ST7FOXK1, ST7FOXK2
12.8
12.8.1
EMC (electromagnetic compatibility) characteristics
Susceptibility tests are performed on a sample basis during product characterization.
Functional EMS (electromagnetic susceptibility)
Based on a simple running application on the product (toggling two LEDs through I/O ports),
the product is stressed by two electromagnetic events until a failure occurs (indicated by the
LEDs).
A device reset allows normal operations to be resumed. The test results are given in the
table below based on the EMS levels and classes defined in application note AN1709.
Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical
application environment and simplified MCU software. It should be noted that good EMC
performance is highly dependent on the user application and the software in particular.
Therefore it is recommended that the user applies EMC software optimization and
prequalification tests in relation with the EMC level requested for his application.
Table 83.
Symbol
V
V
FESD
FFTB
ESD: Electrostatic Discharge (positive and negative) is applied on all pins of the device
until a functional disturbance occurs. This test conforms with the IEC 1000-4-2
standard.
FTB: A Burst of Fast Transient voltage (positive and negative) is applied to V
V
conforms with the IEC 1000-4-4 standard.
Software recommendations
The software flowchart must include the management of runaway conditions such as:
–
–
–
Prequalification trials
Most of the common failures (unexpected reset and Program Counter corruption) can
be reproduced by manually forcing a low state on the RESET pin or the Oscillator pins
for 1 second.
To complete these trials, ESD stress can be applied directly on the device, over the
range of specification values. When unexpected behavior is detected, the software can
be hardened to prevent unrecoverable errors occurring (see application note AN1015).
SS
through a 100 pF capacitor, until a functional disturbance occurs. This test
Corrupted Program Counter
Unexpected reset
Critical Data corruption (control registers...)
Voltage limits to be applied on any I/O pin
applied through 100pF on V
Fast transient voltage burst limits to be
pins to induce a functional disturbance
EMS test results
to induce a functional disturbance
Parameter
DD
and V
SS
V
V
DD
DD
conforms to IEC 1000-4-2
conforms to IEC 1000-4-4
=5 V, T
=5 V, T
A
A
Conditions
=+25 °C, f
=+25 °C, f
Electrical characteristics
OSC
OSC
=8 MHz
=8 MHz
DD
201/226
and
Level/
Class
2B
3B