PIC18F4431-E/P Microchip Technology, PIC18F4431-E/P Datasheet - Page 312

IC MCU FLASH 8KX16 40DIP

PIC18F4431-E/P

Manufacturer Part Number
PIC18F4431-E/P
Description
IC MCU FLASH 8KX16 40DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F4431-E/P

Core Size
8-Bit
Program Memory Size
16KB (8K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, Power Control PWM, QEI, POR, PWM, WDT
Number Of I /o
36
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 9x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
40-DIP (0.600", 15.24mm)
Controller Family/series
PIC18
No. Of I/o's
36
Eeprom Memory Size
256Byte
Ram Memory Size
768Byte
Cpu Speed
40MHz
No. Of Timers
4
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
768 B
Interface Type
EUSART, I2C, SPI, SSP
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
36
Number Of Timers
1 x 8
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
9 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DVA18XP400 - DEVICE ADAPTER 18F4220 PDIP 40LDACICE0206 - ADAPTER MPLABICE 40P 600 MIL
Lead Free Status / Rohs Status
 Details

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Manufacturer
Quantity
Price
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PIC18F4431-E/P
Manufacturer:
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Quantity:
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Manufacturer:
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Quantity:
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Quantity:
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PIC18F2331/2431/4331/4431
POP
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
DS39616D-page 312
Q Cycle Activity:
Before Instruction
After Instruction
Decode
TOS
Stack (1 level down)
TOS
PC
Q1
operation
Pop Top of Return Stack
[ label ]
None
(TOS)  bit bucket
None
The TOS value is pulled off the return
stack and is discarded. The TOS value
then becomes the previous value that
was pushed onto the return stack.
This instruction is provided to enable
the user to properly manage the return
stack to incorporate a software stack.
1
1
POP
GOTO
0000
No
Q2
POP
0000
NEW
POP TOS
=
=
=
=
value
Q3
0x0031A2
0x014332
0x014332
NEW
0000
operation
No
Q4
0110
PUSH
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
Q Cycle Activity:
Before Instruction
After Instruction
Decode
TOS
PC
PC
TOS
Stack (1 level down)
Q1
PC + 2 onto
return stack
Push Top of Return Stack
[ label ]
None
(PC + 2)  TOS
None
The PC + 2 is pushed onto the top of
the return stack. The previous TOS
value is pushed down on the stack.
This instruction allows to implement a
software stack by modifying TOS, and
then push it onto the return stack.
1
1
PUSH
PUSH
0000
Q2
 2010 Microchip Technology Inc.
PUSH
0000
operation
=
=
=
=
=
No
Q3
0x00345A
0x000126
0x00345A
0x000124
0x000126
0000
operation
No
Q4
0101

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