PIC18F4431-E/P Microchip Technology, PIC18F4431-E/P Datasheet - Page 283

• Manufacturer Part Number: PIC18F4431-E/P
• Description: IC MCU FLASH 8KX16 40DIP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F4431-E/P

• Core Size: 8-Bit
• Program Memory Size: 16KB (8K x 16)
• Core Processor: PIC
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, Power Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 36
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 9x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 40-DIP (0.600", 15.24mm)
• Controller Family/series: PIC18
• No. Of I/o's: 36
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 768Byte
• Cpu Speed: 40MHz
• No. Of Timers: 4
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: EUSART, I2C, SPI, SSP
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 36
• Number Of Timers: 1 x 8
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 9 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DVA18XP400 - DEVICE ADAPTER 18F4220 PDIP 40LDACICE0206 - ADAPTER MPLABICE 40P 600 MIL
• Lead Free Status / Rohs Status: Details

24.0
The PIC18 instruction set adds many enhancements to
the previous PIC
easy migration from these PIC instruction sets.
Most instructions are a single program memory word
(16 bits), but there are three instructions that require
two program memory locations.
Each single-word instruction is a 16-bit word divided
into an opcode, which specifies the instruction type and
one or more operands, which further specify the
operation of the instruction.
The instruction set is highly orthogonal and is grouped
into four basic categories:
• Byte-oriented operations
• Bit-oriented operations
• Literal operations
• Control operations
The PIC18 instruction set summary in
byte-oriented, bit-oriented, literal and control
operations.
descriptions.
Most byte-oriented instructions have three operands:
1.
2.
3.
The file register designator, ‘f’, specifies which file
register is to be used by the instruction.
The destination designator, ‘d’, specifies where the result
of the operation is to be placed. If ‘d’ is ‘0’, the result is
placed in the WREG register. If ‘d’ is ‘1’, the result is
placed in the file register specified in the instruction.
All bit-oriented instructions have three operands:
1.
2.
3.
The bit field designator, ‘b’, selects the number of the bit
affected by the operation, while the file register desig-
nator, ‘f’, represents the number of the file in which the
bit is located.
The literal instructions may use some of the following
operands:
• A literal value to be loaded into a file register
• The desired FSR register to load the literal value
• No operand required
 2010 Microchip Technology Inc.
(specified by ‘k’)
into (specified by ‘f’)
(specified by ‘—’)
The file register (specified by ‘f’)
The destination of the result
(specified by ‘d’)
The accessed memory
(specified by ‘a’)
The file register (specified by ‘f’)
The bit in the file register
(specified by ‘b’)
The accessed memory
(specified by ‘a’)
INSTRUCTION SET SUMMARY
Table 24-1
®
instruction sets, while maintaining an
shows the opcode field
Table 24-2
PIC18F2331/2431/4331/4431
lists
The control instructions may use some of the following
operands:
• A program memory address (specified by ‘n’)
• The mode of the call or return instructions
• The mode of the table read and table write
• No operand required
All instructions are a single word, except for three
double-word instructions. These three instructions were
made double word instructions so that all the required
information is available in these 32 bits. In the second
word, the 4 MSbs are ‘1’s. If this second word is
executed as an instruction (by itself), it will execute as a
NOP.
All single-word instructions are executed in a single
instruction cycle, unless a conditional test is true or the
program counter is changed as a result of the instruc-
tion. In these cases, the execution takes two instruction
cycles with the additional instruction cycle(s) executed
as a NOP.
The double word instructions execute in two instruction
cycles.
One instruction cycle consists of four oscillator periods.
Thus, for an oscillator frequency of 4 MHz, the normal
instruction execution time is 1 s. If a conditional test is
true or the program counter is changed as a result of
an instruction, the instruction execution time is 2 s.
Two-word branch instructions (if true) would take 3 s.
Figure 24-1
instructions can have.
All examples use the format ‘nnh’ to represent a hexa-
decimal number, where ‘h’ signifies a hexadecimal
digit.
The Instruction Set Summary, shown in
lists the instructions recognized by the Microchip
Assembler
“Instruction Set”
instruction.
24.1
Any instruction that specifies a file register as part of
the instruction performs a Read-Modify-Write (R-M-W)
operation. The register is read, the data is modified,
and the result is stored according to either the instruc-
tion or the destination designator, ‘d’. A read operation
is performed on a register even if the instruction writes
to that register.
For example, a “BCF PORTB, 1” instruction will read
PORTB, clear bit 1 of the data, then write the result back
to PORTB. The read operation would have the unin-
tended result that any condition that sets the RBIF flag
would be cleared. The R-M-W operation may also copy
the level of an input pin to its corresponding output latch.
(specified by ‘s’)
instructions (specified by ‘m’)
(specified by ‘—’)
Read-Modify-Write Operations
(MPASM
shows the general formats that the
provides a description of each
TM
Assembler).
DS39616D-page 283
Section 24.2
Table
24-2,