AT91SAM9M10-CU Atmel, AT91SAM9M10-CU Datasheet - Page 987

• Manufacturer Part Number: AT91SAM9M10-CU
• Description: IC MCU 16/32BIT ARM9 324TFBGA
• Manufacturer: Atmel
• Series: AT91SAMr

Specifications of AT91SAM9M10-CU

• Core Processor: ARM9
• Core Size: 16/32-Bit
• Speed: 400MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SPI, SSC, UART/USART, USB
• Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
• Number Of I /o: 160
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: ROM
• Ram Size: 128K x 8
• Voltage - Supply (vcc/vdd): 0.9 V ~ 1.1 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 324-TFBGA
• Processor Series: AT91SAMx
• Core: ARM926EJ-S
• Data Bus Width: 32 bit
• Data Ram Size: 32 KB
• Interface Type: 2-Wire, SPI, USART
• Maximum Clock Frequency: 133 MHz
• Number Of Programmable I/os: 5
• Number Of Timers: 2 x 16 bit
• Operating Supply Voltage: 1.65 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: AT91SAM-ICE, AT91-ISP, AT91SAM9M10-G45-EK
• Controller Family/series: AT91
• No. Of I/o's: 160
• Ram Memory Size: 64KB
• Cpu Speed: 400MHz
• No. Of Timers: 2
• Rohs Compliant: Yes
• Cpu Family: AT91
• Device Core: ARM926EJ-S
• Device Core Size: 32b
• Frequency (max): 400MHz
• Total Internal Ram Size: 64KB
• # I/os (max): 160
• Number Of Timers - General Purpose: 7
• Operating Supply Voltage (typ): 1.8/2.5/3.3V
• Operating Supply Voltage (max): 1.1/1.95/3.6V
• Operating Supply Voltage (min): 0.9/1.65/1.8/3V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 324
• Package Type: TFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Figure 41-9. Multi-buffer DMAC Transfer with Source and Destination Address Auto-reloaded
6355B–ATARM–21-Jun-10
Source Layer
Address of
6. The DMAC transfer proceeds as follows:
Channel Enable in the Channel Status Register (DMAC_CHSR.ENABLE[n]) until it is
disabled, to detect when the transfer is complete. If the DMAC is not in Row 1, the next
step is performed.
a. If interrupts is un-masked (DMAC_EBCIMR.BTC[x] = ‘1’, where x is the channel
b. If the buffer complete interrupt is masked (DMAC_EBCIMR.BTC[x] = ‘1’, where x is
SADDR
number) hardware sets the buffer complete interrupt when the buffer transfer has
completed. It then stalls until the STALLED[n] bit of DMAC_CHSR register is
cleared by software, writing ‘1’ to DMAC_CHER.KEEPON[n] bit where n is the
channel number. If the next buffer is to be the last buffer in the DMAC transfer, then
the buffer complete ISR (interrupt service routine) should clear the automatic mode
bit in the DMAC_CTRLBx.AUTO bit. This put the DMAC into Row 1 as shown in
Table 41-2 on page
fer, then the reload bits should remain enabled to keep the DMAC in Row 4.
the channel number), then hardware does not stall until it detects a write to the buf-
fer complete interrupt enable register DMAC_EBCIER register but starts the next
buffer transfer immediately. In this case software must clear the automatic mode bit
in the DMAC_CTRLB to put the DMAC into ROW 1 of
before the last buffer of the DMAC transfer has completed. The transfer is similar to
that shown in
41-10 on page
Source Buffers
Figure 41-9 on page
988.
978. If the next buffer is not the last buffer in the DMAC trans-
Block2
Block1
Block0
BlockN
Destination Buffers
987. The DMAC transfer flow is shown in
DADDR
Destination Layer
Address of
Table 41-2 on page 978
AT91SAM9M10
Figure
987