AT91SAM9M10-CU Atmel, AT91SAM9M10-CU Datasheet - Page 748

• Manufacturer Part Number: AT91SAM9M10-CU
• Description: IC MCU 16/32BIT ARM9 324TFBGA
• Manufacturer: Atmel
• Series: AT91SAMr

Specifications of AT91SAM9M10-CU

• Core Processor: ARM9
• Core Size: 16/32-Bit
• Speed: 400MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SPI, SSC, UART/USART, USB
• Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
• Number Of I /o: 160
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: ROM
• Ram Size: 128K x 8
• Voltage - Supply (vcc/vdd): 0.9 V ~ 1.1 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 324-TFBGA
• Processor Series: AT91SAMx
• Core: ARM926EJ-S
• Data Bus Width: 32 bit
• Data Ram Size: 32 KB
• Interface Type: 2-Wire, SPI, USART
• Maximum Clock Frequency: 133 MHz
• Number Of Programmable I/os: 5
• Number Of Timers: 2 x 16 bit
• Operating Supply Voltage: 1.65 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: AT91SAM-ICE, AT91-ISP, AT91SAM9M10-G45-EK
• Controller Family/series: AT91
• No. Of I/o's: 160
• Ram Memory Size: 64KB
• Cpu Speed: 400MHz
• No. Of Timers: 2
• Rohs Compliant: Yes
• Cpu Family: AT91
• Device Core: ARM926EJ-S
• Device Core Size: 32b
• Frequency (max): 400MHz
• Total Internal Ram Size: 64KB
• # I/os (max): 160
• Number Of Timers - General Purpose: 7
• Operating Supply Voltage (typ): 1.8/2.5/3.3V
• Operating Supply Voltage (max): 1.1/1.95/3.6V
• Operating Supply Voltage (min): 0.9/1.65/1.8/3V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 324
• Package Type: TFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

35.13.12 HSMCI Status Register
Name:
Addresses:
Access:
• CMDRDY: Command Ready
0 = A command is in progress.
1 = The last command has been sent. Cleared when writing in the HSMCI_CMDR.
• RXRDY: Receiver Ready
0 = Data has not yet been received since the last read of HSMCI_RDR.
1 = Data has been received since the last read of HSMCI_RDR.
• TXRDY: Transmit Ready
0 = The last data written in HSMCI_TDR has not yet been transferred in the Shift Register.
1 = The last data written in HSMCI_TDR has been transferred in the Shift Register.
• BLKE: Data Block Ended
This flag must be used only for Write Operations.
0 = A data block transfer is not yet finished. Cleared when reading the HSMCI_SR.
1 = A data block transfer has ended, including the CRC16 Status transmission.
the flag is set for each transmitted CRC Status.
Refer to the MMC or SD Specification for more details concerning the CRC Status.
• DTIP: Data Transfer in Progress
0 = No data transfer in progress.
1 = The current data transfer is still in progress, including CRC16 calculation. Cleared at the end of the CRC16 calculation.
• NOTBUSY: HSMCI Not Busy
This flag must be used only for Write Operations.
A block write operation uses a simple busy signalling of the write operation duration on the data (DAT0) line: during a data
transfer block, if the card does not have a free data receive buffer, the card indicates this condition by pulling down the data
line (DAT0) to LOW. The card stops pulling down the data line as soon as at least one receive buffer for the defined data
transfer block length becomes free.
The NOTBUSY flag allows to deal with these different states.
6355B–ATARM–21-Jun-10
CSTOE
UNRE
31
23
15
–
7
–
OVRE
DTOE
30
22
14
HSMCI_SR
0xFFF80040 (0), 0xFFFD0040 (1)
Read-only
–
6
–
ACKRCVE
NOTBUSY
DCRCE
CSRCV
29
21
13
5
SDIOWAIT
ACKRCV
RTOE
DTIP
28
20
12
4
XFRDONE
RENDE
BLKE
27
19
11
–
3
FIFOEMPTY
RCRCE
TXRDY
26
18
10
–
2
AT91SAM9M10
DMADONE
RXRDY
RDIRE
25
17
9
–
1
MCI_SDIOIR
BLKOVRE
CMDRDY
RINDE
QA
24
16
8
0
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