AT91SAM9M10-CU Atmel, AT91SAM9M10-CU Datasheet - Page 269
AT91SAM9M10-CU
Manufacturer Part Number
AT91SAM9M10-CU
Description
IC MCU 16/32BIT ARM9 324TFBGA
Manufacturer
Atmel
Series
AT91SAMr
Specifications of AT91SAM9M10-CU
Core Processor
ARM9
Core Size
16/32-Bit
Speed
400MHz
Connectivity
EBI/EMI, Ethernet, I²C, SPI, SSC, UART/USART, USB
Peripherals
AC'97, DMA, LCD, POR, PWM, WDT
Number Of I /o
160
Program Memory Size
64KB (64K x 8)
Program Memory Type
ROM
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
0.9 V ~ 1.1 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
324-TFBGA
Processor Series
AT91SAMx
Core
ARM926EJ-S
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
2-Wire, SPI, USART
Maximum Clock Frequency
133 MHz
Number Of Programmable I/os
5
Number Of Timers
2 x 16 bit
Operating Supply Voltage
1.65 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
AT91SAM-ICE, AT91-ISP, AT91SAM9M10-G45-EK
Controller Family/series
AT91
No. Of I/o's
160
Ram Memory Size
64KB
Cpu Speed
400MHz
No. Of Timers
2
Rohs Compliant
Yes
Cpu Family
AT91
Device Core
ARM926EJ-S
Device Core Size
32b
Frequency (max)
400MHz
Total Internal Ram Size
64KB
# I/os (max)
160
Number Of Timers - General Purpose
7
Operating Supply Voltage (typ)
1.8/2.5/3.3V
Operating Supply Voltage (max)
1.1/1.95/3.6V
Operating Supply Voltage (min)
0.9/1.65/1.8/3V
On-chip Adc
8-chx10-bit
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
324
Package Type
TFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AT91SAM9M10-CU
Manufacturer:
Atmel
Quantity:
996
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22.7.7
Name:
Access:
Reset:
• LPCB: Low-power Command Bit
Reset value is “00”.
00 = Low-power Feature is inhibited: no power-down, self refresh and Deep power mode are issued to the SDRAM device.
01 = The DDRSDRC issues a Self Refresh Command to the SDRAM device, the clock(s) is/are de-activated and the CKE
signal is set low. The SDRAM device leaves the self refresh mode when accessed and enters it after the access.
10 = The DDRSDRC issues a Power-down Command to the SDRAM device after each access, the CKE signal is set low.
The SDRAM device leaves the power-down mode when accessed and enters it after the access.
11 = The DDRSDRC issues a Deep Power-down Command to the Low-power SDRAM device.This mode is unique to
Low-power SDRAM devices.
• CLK_FR: Clock Frozen Command Bit
Reset value is “0”.
This field sets the clock low during power-down mode or during deep power-down mode. Some SDRAM devices do not
support freezing the clock during power-down mode or during deep power-down mode. Refer to the SDRAM device
datasheet for details on this.
1 = Clock(s) is/are frozen.
0 = Clock(s) is/are not frozen.
• PASR: Partial Array Self Refresh
Reset value is “0”.
This field is unique to Low-power SDRAM. It is used to specify whether only one quarter, one half or all banks of the
SDRAM array are enabled. Disabled banks are not refreshed in self refresh mode.
The values of this field are dependant on Low-power SDRAM devices.
After the initialization sequence, as soon as PASR field is modified, Extended Mode Register in the external device mem-
ory is accessed automatically and PASR bits are updated. In function of the UPD_MR bit, update is done before entering in
self refresh mode or during a refresh command and a pending read or write access.
6355B–ATARM–21-Jun-10
31
23
15
–
7
–
–
–
DDRSDRC Low-power Register
30
22
14
DDRSDRC_LPR
Read-write
See
–
6
–
–
Table 22-9
PASR
29
21
13
5
–
TIMEOUT
UPD_MR
28
20
12
4
–
27
19
11
3
–
–
DS
CLK_FR
26
18
10
2
–
–
AT91SAM9M10
25
17
9
1
–
–
LPCB
TCR
APDE
24
16
8
0
–
269
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