MPC555LFMZP40 Freescale Semiconductor, MPC555LFMZP40 Datasheet - Page 92

• Manufacturer Part Number: MPC555LFMZP40
• Description: IC MCU 32BIT 40MHZ 272-BGA
• Manufacturer: Freescale Semiconductor
• Series: MPC5xxr

Specifications of MPC555LFMZP40

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 101
• Program Memory Size: 448KB (448K x 8)
• Program Memory Type: FLASH
• Ram Size: 26K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 272-PBGA
• Controller Family/series: POWER 5xx
• Ram Memory Size: 26KB
• Cpu Speed: 63MIPS
• Embedded Interface Type: QSPI, SCI, TouCAN
• Operating Temperature Range: -40°C To +125°C
• No. Of Pins: 272
• Rohs Compliant: No
• Processor Series: MPC5xx
• Core: PowerPC
• Data Bus Width: 32 bit
• Data Ram Size: 26 KB
• Interface Type: CAN, QSPI, SCI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 101
• Operating Supply Voltage: 3.3 V to 5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: MPC555CMEE
• Minimum Operating Temperature: - 85 C
• On-chip Adc: 10 bit, 32 Channel
• Cpu Family: MPC55xx
• Device Core: PowerPC
• Device Core Size: 32b
• Frequency (max): 40MHz
• Total Internal Ram Size: 32KB
• # I/os (max): 101
• Operating Supply Voltage (typ): 5V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 272
• Package Type: BGA
• For Use With: MPC555CMEE - KIT EVAL FOR MPC555
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No

MPC555
USER’S MANUAL
IRQOUT/LWP[0]
SGPIOC[7/
VFLS[0:1]
ENGCLK/
EXTCLK
IWP[0:1]/
CLKOUT
EXTAL
LWP[1]
BUCLK
IWP[2]
IWP[3]
DSDO
XTAL
DSCK
VF[0]/
VF[1]/
VF[2]/
TRST
DSDI
TDO/
TCK/
TMS
TDI/
XFC
/
Pin
BG/
BR/
BB/
MPC556
3
3
3
Function
SGPIOC[7]
VFLS[0:1]
Freescale Semiconductor, Inc.
CLKOUT
ENGCLK
IRQOUT
IWP[0:1]
EXTCLK
Table 2-4 Pin Reset State (Continued)
LWP[0]
LWP[1]
BUCLK
EXTAL
IWP[2]
IWP[3]
DSDO
DSCK
TRST
XTAL
VF[0]
VF[1]
VF[2]
DSDI
TMS
TCK
TDO
XFC
BB
For More Information On This Product,
TDI
BG
BR
4
Go to: www.freescale.com
SIGNAL DESCRIPTIONS
Rev. 15 October 2000
I/O
I/O
I/O
I/O
Port
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
I
I
I
I
I
I
I
I
I
I
Voltage
5 V
3 V
3 V
3 V
3 V
3 V
3 V
3 V
3 V
3 V
3 V
3 V
3 V
3 V
3 V
3 V
3 V
3 V
3 V
3 V
3 V
3 V
3 V
3 V
3 V
3 V
3 V
5 V
5 V
PU5 until PRDS is set
PU5 until reset negates
PU5 until reset negates
PU3 when driver not enabled
or until SPRDS is set
PU3 when driver not enabled
or until SPRDS is set
PU3 when driver not enabled
or until SPRDS is set
PU3 until reset negates
PU3 until SPRDS is set
PU3 until SPRDS is set
PD until SPRDS is set
PU3 until reset negates
PU3 until SPRDS is set
—
—
—
—
—
—
—
Reset State
1
1
MOTOROLA
2-34