PIC18F67J10-I/PT Microchip Technology, PIC18F67J10-I/PT Datasheet - Page 6

• Manufacturer Part Number: PIC18F67J10-I/PT
• Description: IC PIC MCU FLASH 64KX16 64TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F67J10-I/PT

• Program Memory Type: FLASH
• Program Memory Size: 128KB (64K x 16)
• Package / Case: 64-TFQFP
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 50
• Ram Size: 3.8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 3936 B
• Interface Type: SPI/I2C/EUSART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 50
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DV164136, DM183032, DM183022
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 11-ch x 10-bit
• A/d Bit Size: 10 bit
• A/d Channels Available: 11
• Height: 1 mm
• Length: 10 mm
• Supply Voltage (max): 2.7 V, 3.6 V
• Supply Voltage (min): 2 V, 2.7 V
• Width: 10 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: MA180015 - MODULE PLUG-IN 18F87J10 FOR HPCAC162062 - HEADER INTRFC MPLAB ICD2 64/80PAC164327 - MODULE SKT FOR 64TQFP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC18F87J10
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 I/O Ports ................................................................................................................................................................................... 121
11.0 Timer0 Module ......................................................................................................................................................................... 147
12.0 Timer1 Module ......................................................................................................................................................................... 151
13.0 Timer2 Module ......................................................................................................................................................................... 157
14.0 Timer3 Module ......................................................................................................................................................................... 159
15.0 Timer4 Module ......................................................................................................................................................................... 163
16.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 165
17.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 173
18.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 189
19.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 235
20.0 10-bit Analog-to-Digital Converter (A/D) Module ...................................................................................................................... 257
21.0 Comparator Module.................................................................................................................................................................. 267
22.0 Comparator Voltage Reference Module ................................................................................................................................... 273
23.0 Special Features of the CPU .................................................................................................................................................... 277
24.0 Instruction Set Summary .......................................................................................................................................................... 289
25.0 Development Support............................................................................................................................................................... 339
26.0 Electrical Characteristics .......................................................................................................................................................... 343
27.0 Packaging Information.............................................................................................................................................................. 379
Appendix A: Migration Between High-End Device Families............................................................................................................... 383
Index .................................................................................................................................................................................................. 385
The Microchip Web Site ..................................................................................................................................................................... 395
Customer Change Notification Service .............................................................................................................................................. 395
Customer Support .............................................................................................................................................................................. 395
Reader Response .............................................................................................................................................................................. 396
Product Identification System............................................................................................................................................................. 397
DS39663D-page 4
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Device Overview .......................................................................................................................................................................... 5
Oscillator Configurations ............................................................................................................................................................ 27
Power-Managed Modes ............................................................................................................................................................. 35
Reset .......................................................................................................................................................................................... 43
Memory Organization ................................................................................................................................................................. 55
Flash Program Memory .............................................................................................................................................................. 81
External Memory Bus ................................................................................................................................................................. 91
8 x 8 Hardware Multiplier.......................................................................................................................................................... 103
Interrupts .................................................................................................................................................................................. 105
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© 2006 Microchip Technology Inc.