PIC18F67J10-I/PT Microchip Technology, PIC18F67J10-I/PT Datasheet - Page 320

IC PIC MCU FLASH 64KX16 64TQFP

PIC18F67J10-I/PT

Manufacturer Part Number
PIC18F67J10-I/PT
Description
IC PIC MCU FLASH 64KX16 64TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F67J10-I/PT

Program Memory Type
FLASH
Program Memory Size
128KB (64K x 16)
Package / Case
64-TFQFP
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
50
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3936 B
Interface Type
SPI/I2C/EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
50
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DV164136, DM183032, DM183022
Minimum Operating Temperature
- 40 C
On-chip Adc
11-ch x 10-bit
A/d Bit Size
10 bit
A/d Channels Available
11
Height
1 mm
Length
10 mm
Supply Voltage (max)
2.7 V, 3.6 V
Supply Voltage (min)
2 V, 2.7 V
Width
10 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MA180015 - MODULE PLUG-IN 18F87J10 FOR HPCAC162062 - HEADER INTRFC MPLAB ICD2 64/80PAC164327 - MODULE SKT FOR 64TQFP
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F67J10-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC18F67J10-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
PIC18F67J10-I/PT
0
PIC18F87J10
POP
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
DS39663D-page 318
Q Cycle Activity:
Before Instruction
After Instruction
Decode
TOS
Stack (1 level down)
TOS
PC
Q1
operation
Pop Top of Return Stack
POP
None
(TOS)
None
The TOS value is pulled off the return
stack and is discarded. The TOS value
then becomes the previous value that
was pushed onto the return stack.
This instruction is provided to enable
the user to properly manage the return
stack to incorporate a software stack.
1
1
POP
GOTO
0000
No
Q2
bit bucket
0000
NEW
POP TOS
=
=
=
=
value
Q3
0031A2h
014332h
014332h
NEW
0000
operation
No
Q4
0110
Preliminary
PUSH
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
Q Cycle Activity:
Before Instruction
After Instruction
Decode
TOS
PC
PC
TOS
Stack (1 level down)
Q1
PC + 2 onto
return stack
Push Top of Return Stack
PUSH
None
(PC + 2)
None
The PC + 2 is pushed onto the top of
the return stack. The previous TOS
value is pushed down on the stack.
This instruction allows implementing a
software stack by modifying TOS and
then pushing it onto the return stack.
1
1
PUSH
PUSH
0000
Q2
© 2006 Microchip Technology Inc.
TOS
0000
operation
=
=
=
=
=
No
Q3
345Ah
0124h
0126h
0126h
345Ah
0000
operation
No
Q4
0101

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