PIC18F67J10-I/PT Microchip Technology, PIC18F67J10-I/PT Datasheet - Page 382

IC PIC MCU FLASH 64KX16 64TQFP

PIC18F67J10-I/PT

Manufacturer Part Number
PIC18F67J10-I/PT
Description
IC PIC MCU FLASH 64KX16 64TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F67J10-I/PT

Program Memory Type
FLASH
Program Memory Size
128KB (64K x 16)
Package / Case
64-TFQFP
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
50
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3936 B
Interface Type
SPI/I2C/EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
50
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DV164136, DM183032, DM183022
Minimum Operating Temperature
- 40 C
On-chip Adc
11-ch x 10-bit
A/d Bit Size
10 bit
A/d Channels Available
11
Height
1 mm
Length
10 mm
Supply Voltage (max)
2.7 V, 3.6 V
Supply Voltage (min)
2 V, 2.7 V
Width
10 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MA180015 - MODULE PLUG-IN 18F87J10 FOR HPCAC162062 - HEADER INTRFC MPLAB ICD2 64/80PAC164327 - MODULE SKT FOR 64TQFP
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F67J10-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC18F67J10-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
PIC18F67J10-I/PT
0
PIC18F87J10
27.2
The following sections give the technical details of the
packages.
64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS39663D-page 380
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
JEDEC Equivalent: MS-026
Drawing No. C04-085
Package Details
B
c
*Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed .010" (0.254mm) per side.
p
Dimension Limits
#leads=n1
E1
E
Units
CH
n1
A2
E1
D1
A1
(F)
n
p
E
D
B
A
c
L
L
n
MIN
2
1
.039
.037
.002
.018
.463
.463
.390
.390
.005
.007
.025
Preliminary
0
5
5
D1
CH x 45°
INCHES
D
NOM
64
.020
.043
.006
.024
.472
.472
.394
.394
.007
.035
.039
.039
.009
A1
3.5
16
10
10
A
MAX
.047
.010
.030
.482
.482
.398
.398
.009
.041
.011
.045
15
15
7
(F)
MIN
11.75
11.75
1.00
0.95
0.05
0.45
9.90
9.90
0.13
0.17
0.64
5
5
0
MILLIMETERS*
© 2006 Microchip Technology Inc.
NOM
64
12.00
12.00
10.00
10.00
0.50
1.10
1.00
0.15
0.60
1.00
0.18
0.22
0.89
3.5
16
10
10
A2
MAX
12.25
12.25
10.10
10.10
1.20
1.05
0.25
0.75
0.23
0.27
1.14
15
15
7

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