DEMO9S08LC60 Freescale Semiconductor, DEMO9S08LC60 Datasheet - Page 324

• Manufacturer Part Number: DEMO9S08LC60
• Description: BOARD DEMO FOR 9S08LC60
• Manufacturer: Freescale Semiconductor
• Type: MCUr

Specifications of DEMO9S08LC60

• Contents: Evaluation Board
• Processor To Be Evaluated: MC9S08LC60
• Interface Type: RS-232, USB
• Silicon Manufacturer: Freescale
• Core Architecture: HCS08
• Core Sub-architecture: HCS08
• Silicon Core Number: MC9S08
• Silicon Family Name: S08LC
• Rohs Compliant: Yes
• For Use With/related Products: MC9S08LC60
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Appendix A Electrical Characteristics
A.3
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and voltage regulator circuits and it is user-determined rather than being controlled by the
MCU design. In order to take P
actual pin voltage and V
unusually high pin current (heavy loads), the difference between pin voltage and V
small.
The average chip-junction temperature (T
where:
For most applications, P
(if P
Solving
324
1
2
3
4
Operating temperature range (packaged)
Thermal resistance
I/O
T
θ
P
P
P
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, airflow, power dissipation of other components on the board, and board
thermal resistance.
Junction to Ambient Natural Convection
1s - Single Layer Board, one signal layer
2s2p - Four Layer Board, 2 signal and 2 power layers
80-pin LQFP
64-pin LQFP
JA
D
int
I/O
A
is neglected) is:
= Ambient temperature, °C
= P
Equation A-1
= Package thermal resistance, junction-to-ambient, °C/W
= I
= Power dissipation on input and output pins — user determined
Thermal Characteristics
int
DD
+ P
× V
I/O
DD
Rating
, Watts — chip internal power
and
I/O
SS
Equation A-2
or V
<< P
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
I/O
DD
int
into account in power calculations, determine the difference between
and can be neglected. An approximate relationship between P
and multiply by the pin current for each I/O pin. Except in cases of
Table A-2. Thermal Characteristics
P
2s2p
2s2p
T
D
J
for K gives:
1s
1s
= K ÷ (T
J
= T
) in °C can be obtained from:
A
+ (P
J
θ
JA
D
+ 273°C)
(1), (2)
× θ
Symbol
T
JA
A
,
)
(3)
,
(4)
-40 to 85
Value
64
49
66
47
SS
Freescale Semiconductor
or V
°C/W
Unit
°C
DD
will be very
D
Eqn. A-1
Eqn. A-2
and T
J