PNX1500E NXP Semiconductors, PNX1500E Datasheet - Page 49

• Manufacturer Part Number: PNX1500E
• Manufacturer: NXP Semiconductors

Specifications of PNX1500E

• Lead Free Status / Rohs Status: Not Compliant

NXP Semiconductors
Volume 1 of 1
Table 18: PNX9525 Operating Range and Thermal Characteristics
Table 19: PNX9525 Maximum Operating Speeds
5. Power Considerations
PNX15XX_PNX952X_SER_N_4
Product data sheet
Symbol Description
T
VLIW
CPU
TM3260
(MHz)
240
ambient Operating ambient temperature range.
JC
JA
Top of junction to case thermal resistance (same as
Top of junction to ambient thermal resistance (still air)
DDR-I
(MHz)
183
MMIO
(MHz)
144
5.1 Power Supply Sequencing
5.2 Leakage current Power Consumption
5.3 Standby Power Consumption
2DDE
MBS
VLD
(MHz)
108
No special power sequence is required to operate the PNX15xx/952x Series.
However, in order to guarantee that MM_CKE remains low at power up, the PNX1500
is required to have the VDD power supply to come-up before the VCCM power
supply. This is a JEDEC DDR specification requirement.
Remark: DDR SDRAM devices power supply sequence must also be met. Refer to
the DDR SDRAM vendor specification.
Leakage current is a new variable of the advanced CMOS processes. The maximum
current leakages are:
The resultant power dissipation is at most 146 mW (includes the 3 different power
supplies).
During the standby (sleep) mode, all the clocks of the PNX1500 system are turned
off. A small amount of logic stays alive in order to wake-up the system.
•
•
•
60 mA for VDD at 85 ˚C (case temperature)
3 mA for VCCM at 85 ˚C (case temperature)
20 mA for VCCP at 85 ˚C (case temperature)
QVCP
(qvcp_out,
qvcp_proc,
Dual Edge)
(MHz)
75, 96, 75
Rev. 4.0 — 03 December 2007
VIP
(MHz)
65
FGPO
FGPI
(MHz)
81
JT
)
DVDD
(MHz)
54
Minimum
-40
-
-
PCI-
XIO
(MHz)
33
PNX15xx/952x Series
Chapter 1: Integrated Circuit Data
LAN
(MHz)
25
Typical
-
6.1
24.3
AO
AI
(MHz)
20
© NXP B.V. 2007. All rights reserved.
Maximum
85
-
-
SPDO
(MHz)
35
GPIO
(MHz)
108
Units
˚C
˚C/W
˚C/W
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