TMP92xy29FG Toshiba, TMP92xy29FG Datasheet - Page 652

• Manufacturer Part Number: TMP92xy29FG
• Manufacturer: Toshiba

Specifications of TMP92xy29FG

• Package: QFP176
• Rom Types(m=mask,p=otp, F=flash,e=eeprom): Romless
• Rom Combinations: Romless
• Ram Combinations: 144
• Architecture: 32-bit CISC
• Usb/spi Channels: 1/1
• Uart/sio Channels: 2
• I2c/sio Bus Channels: 1
• (s)dram Controller: 1
• Adc 10-bit Channel: 6
• Da Converter: -
• Timer 8-bit Channel: 8
• Timer 16-bit Channel: 2
• Pwm 8-bit Channels: -
• Pwm 16-bit Channels: -
• Cs/wait Controller: 4
• Dual Clock: Y
• Number Of I/o Ports: 98
• Power Supply Voltage(v): 3.0 to 3.6

4.
4.1
Electrical Characteristics
parameter
Solderability
Absolute Maximum Ratings
Solderability
Test
Note1: If setting it, don’t exceed the Maximum Ratings of DVCC3A.
Note2: In PG0 to PG5, P96,P97,VREFH,VREFL maximum ratings for AVCC is applied.
Note3: The absolute maximum ratings are rated values that must not be exceeded during operation, even for an
Symbol
DVCC1C
DVCC3A
DVCC1A
DVCC1B
T
AVCC
SOLDER
T
T
instant. Any one of the ratings must not be exceeded. If any absolute maximum rating is exceeded, a device
may break down or its performance may be degraded, causing it to catch fire or explode resulting in injury to
the user. Thus, when designing products that include this device, ensure that no absolute maximum rating
value will ever be exceeded.
Σ I
Σ I
I
V
I
P
STG
OPR
OH
OL
OH
OL
IN
D
Use of Sn-37Pb solder Bath
Solder bath temperature = 230°C, Dipping time = 5 seconds
The number of times = one, Use of R-type flux
Use of Sn-3.0Ag-0.5Cu lead-free solder bath
Solder bath temperature = 245°C, Dipping time = 5 seconds
The number of times = one, Use of R-type flux
Power Supply Voltage
Input Voltage
Output Current (1pin)
Output Current (1pin)
Output Current (total)
Output Current (total)
Power Dissipation (Ta = 85°C)
Soldering Temperature (10s)
Storage Temperature
Operation Temperature
Contents
Test condition
92CF29A-650
-0.3 to DVCC3A+0.3 (Note1)
-0.3 to AVCC + 0.3 (Note2)
-0.3 to 3.9
-0.3 to 3.0
-0.3 to 3.9
-65 to 150
Rating
-0 to 70
600
260
-15
-50
15
80
Pass:
solderability rate until forming ≥ 95%
Unit
mW
mA
mA
mA
mA
°C
°C
°C
Note
TMP92CF29A
V
V
2009-06-11