SAM9XE512 Atmel Corporation, SAM9XE512 Datasheet - Page 249

• Manufacturer Part Number: SAM9XE512
• Manufacturer: Atmel Corporation

Specifications of SAM9XE512

• Flash (kbytes): 512 Kbytes
• Pin Count: 217
• Max. Operating Frequency: 180 MHz
• Cpu: ARM926
• Hardware Qtouch Acquisition: No
• Max I/o Pins: 96
• Ext Interrupts: 96
• Usb Transceiver: 3
• Usb Speed: Full Speed
• Usb Interface: Host, Device
• Spi: 2
• Twi (i2c): 2
• Uart: 6
• Ssc: 1
• Ethernet: 1
• Sd / Emmc: 1
• Graphic Lcd: No
• Video Decoder: No
• Camera Interface: Yes
• Adc Channels: 4
• Adc Resolution (bits): 10
• Adc Speed (ksps): 312
• Resistive Touch Screen: No
• Temp. Sensor: No
• Crypto Engine: No
• Sram (kbytes): 32
• Self Program Memory: NO
• External Bus Interface: 1
• Dram Memory: sdram
• Nand Interface: Yes
• Picopower: No
• Temp. Range (deg C): -40 to 85
• I/o Supply Class: 1.8/3.3
• Operating Voltage (vcc): 1.65 to 1.95
• Fpu: No
• Mpu / Mmu: No / Yes
• Timers: 6
• Output Compare Channels: 6
• Input Capture Channels: 6
• 32khz Rtc: Yes
• Calibrated Rc Oscillator: No

24.5.5.2
Figure 24-7. Low-power Mode Behavior
6254C–ATARM–22-Jan-10
SDRAMC_A[12:0]
SDCKE
D[31:0]
SDCS
SDCK
(input)
RAS
CAS
Low-power Mode
This mode is selected by programming the LPCB field to 2 in the SDRAMC Low Power Register.
Power consumption is greater than in self-refresh mode. All the input and output buffers of the
SDRAM device are deactivated except SDCKE, which remains low. In contrast to self-refresh
mode, the SDRAM device cannot remain in low-power mode longer than the refresh period (64
ms for a whole device refresh operation). As no auto-refresh operations are performed by the
SDRAM itself, the SDRAM Controller carries out the refresh operation. The exit procedure is
faster than in self-refresh mode. This is described in
Row n
T
RCD
= 3
col a
AT91SAM9XE128/256/512 Preliminary
CAS = 2
col b
Dna
col c
Dnb
col d
Dnc
col e
Dnd
Figure
col f
Dne
24-7.
Dnf
Low Power Mode
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