PEB2256H-V12 Infineon Technologies, PEB2256H-V12 Datasheet - Page 359
![no-image](/images/manufacturer_photos/0/3/327/infineon_technologies_sml.jpg)
PEB2256H-V12
Manufacturer Part Number
PEB2256H-V12
Description
IC INTERFACE LINE 3.3V 80-MQFP
Manufacturer
Infineon Technologies
Datasheet
1.PEB2256H-V12.pdf
(490 pages)
Specifications of PEB2256H-V12
Applications
*
Interface
*
Voltage - Supply
*
Package / Case
80-SQFP
Mounting Type
Surface Mount
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
PEB2256H-V12
PEB2256H-V12IN
PEB2256H-V12IN
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PEB2256H-V12
Manufacturer:
Infineon Technologies
Quantity:
10 000
- Current page: 359 of 490
- Download datasheet (6Mb)
Receive Control 1 (Read/Write)
Value after reset: 9C
RC1
RCO(7:0)
Data Sheet
RCO7
7
Receive Offset/Receive Frame Marker Offset
Depending on the RP(A to D) pin function different offsets can be
programmed. The SYPR and the RFM pin function cannot be
selected in parallel.
Receive Offset (PC(4:1).RPC(2:0) = 000)
Initial value loaded into the receive bit counter at the trigger edge of
SCLKR when the synchronous pulse on port SYPR is active.
Calculation of delay time T (SCLKR cycles) depends on the value X
of the receive offset register RC(1:0):
system clocking rate: modulo 2.048 MHz (SIC2.SSC2 = 0)
0
5
with maximum delay = (256 SC/SD) -1
with SC = system clock defined by SIC1.SSC(1:0)+SIC2.SSC2
with SD = system data rate
or
system clocking rate: modulo 1.544 MHz (SIC2.SSC2 = 1)
0
5
with maximum delay = 193 SC/SD - 1
with SC = system clock defined by SIC1.SSC(1:0)+SIC2.SSC2
with SD = system data rate
Delay time T = time between beginning of time slot 0 at RDO and the
initial edge of SCLKR after SYPR goes active.
See
H
T
T
T
T
page 168
maximum delay:X = 2052 - T
4:X = 4 - T + (7
maximum delay :X = (200
4:X = 4 - T
RCO5
for further description.
359
SC/SD)
SC/SD) + 4 - T
T1/J1 Registers
RCO0
FALC56 V1.2
0
PEB 2256
2002-08-27
(25)
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