MCIMX53-START Freescale Semiconductor, MCIMX53-START Datasheet - Page 3

• Manufacturer Part Number: MCIMX53-START
• Description: KIT DEVELOPMENT I.MX53
• Manufacturer: Freescale Semiconductor
• Series: i.MX53r
• Type: MCUr

Specifications of MCIMX53-START

• Contents: Board
• Silicon Manufacturer: Freescale
• Core Architecture: ARM
• Core Sub-architecture: Cortex - A8
• Silicon Core Number: I.MX5
• Silicon Family Name: I.MX53
• Peak Reflow Compatible (260 C): Yes
• Rohs Compliant: Yes
• Leaded Process Compatible: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: i.MX53
• Lead Free Status / Rohs Status: Supplier Unconfirmed

1.1
Table 1
1.2
The i.MX53xD multimedia applications processor (AP) is based on the ARM Platform, which has the
following features:
The memory system consists of the following components:
Freescale Semiconductor
1
2
PCIMX535DVV1B
PCIMX538DZK1B
Part numbers with a PC prefix indicate non production engineering parts.
Case TEPBGA-2 is RoHS compliant, lead-free MSL (moisture sensitivity level) 3.
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•
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Part Number
MMU, L1 instruction and L1 data cache
Unified L2 cache
Target frequency of the core (including Neon, VFPv3 and L1 cache): 1 GHz
Neon coprocessor (SIMD media processing architecture) and vector floating point (VFP-Lite)
coprocessor supporting VFPv3
TrustZone
Level 1 cache:
— Instruction (32 Kbyte)
— Data (32 Kbyte)
Level 2 cache:
— Unified instruction and data (256 Kbyte)
Level 2 (internal) memory:
— Boot ROM, including HAB (64 Kbyte)
— Internal multimedia/shared, fast access RAM (128 Kbyte)
— Secure/non-secure RAM (16 Kbyte)
External memory interfaces:
— 16/32-bit DDR2-800, LV-DDR2-800 or DDR3-800 up to 2 Gbyte
— 32bit LPDDR2
— 8/16-bit NAND SLC/MLC Flash, up to 66 MHz, 4/8/14/16-bit ECC
— 8,16-bit NOR Flash, PSRAM & cellular RAM.
provides ordering information.
Ordering Information
Features
1
Mask
N78C
N78C
Set
i.MX53xD Applications Processors for Consumer Products, Rev. 1
1 GHz, full feature set
1 GHz, full feature set
Table 1. Ordering Information
Features
Temperature
Range (
-20 to +85
-20 to +85
Case
°
C)
19 x 19 mm, 0.8 mm pitch BGA
Case TEPBGA-2
12x12 0.4P PoP
Package
2
Introduction
3