AT91SAM9261SB-CU-999 Atmel, AT91SAM9261SB-CU-999 Datasheet - Page 672

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AT91SAM9261SB-CU-999

Manufacturer Part Number
AT91SAM9261SB-CU-999
Description
IC MCU ARM9 ULTRA LP 217LFBGA
Manufacturer
Atmel
Series
AT91SAMr
Datasheet

Specifications of AT91SAM9261SB-CU-999

Core Processor
ARM9
Core Size
16/32-Bit
Speed
190MHz
Connectivity
EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
Peripherals
DMA, LCD, POR, PWM, WDT
Number Of I /o
96
Program Memory Size
32KB (32K x 8)
Program Memory Type
ROM
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
1.08 V ~ 1.32 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
217-LFBGA
Processor Series
AT91SAMx
Core
ARM926EJ-S
Data Bus Width
32 bit
Data Ram Size
16 KB
Interface Type
2-Wire, I2S, SPI, USB
Maximum Clock Frequency
190 MHz
Number Of Programmable I/os
96
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
AT91SAM-ICE, AT91-ISP, AT91SAM9261-EK
Minimum Operating Temperature
- 40 C
For Use With
AT91SAM9261-EK - KIT EVAL FOR AT91SAM926EJ-SAT91SAM-ICE - EMULATOR FOR AT91 ARM7/ARM9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
 Details

Available stocks

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Price
Part Number:
AT91SAM9261SB-CU-999
Manufacturer:
Atmel
Quantity:
10 000
42.2.8
42.2.8.1
42.2.8.2
42.2.8.3
42.2.9
42.2.9.1
42.2.9.2
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AT91SAM9261S
SDRAM Controller
Serial Peripheral Interface (SPI)
SDRAM: SDCLK Clock Active After Reset
SDRAM: JEDEC Standard Compatibility
SDRAM: Mobile SDRAM Device Initialization Constraint
SPI: Pulse Generation on SPCK
SPI: Bad PDC Behavior when CSAAT=1 and SCBR = 1
After a reset the SDRAM clock is always active leading in over consumption in the pad.
The following sequence allows to stop the SDRAM clock.
In the current configuration, SDCKE rises at the same time as SDCK, while exiting self-refresh
mode. To be fully compliant with the JEDEC standard, SDCK must be stable before the rising
edge of SDCKE. This is not the case in this product.
Use a fully JEDEC compliant SDRAM module.
Using Mobile SDRAM devices that need to have their DQMx level HIGH during the Mobile
SDRAM device initialization, may lead to data bus contention. Therefore, external memories on
the same EBI must not be accessed.
This does not apply to Mobile SDRAM devices whose DQMx level is “don’t care” during this
phase.
Mobile SDRAM initialization must be performed in internal SRAM.
In Master Mode, there is an additional pulse generated on SPCK when the SPI is configured as
follows:
Do not use this configuration.
If the SPI2 is programmed with CSAAT = 1, SCBR(baudrate) = 1 and two transfers are per-
formed consecutively on the same slave with an IDLE state between them, the second data is
sent twice.
None. Do not use the combination CSAAT=1 and SCBR =1.
1. Set the bit LPCB to 01 (Self-refresh) in the SDRAMC Low Power Register.
2. Write 0 in the SDRAMC Mode Register and perform a dummy write in SDRAM to
Problem Fix/Workaround
Problem Fix/Workaround
Problem Fix/Workaround
Problem Fix/Workaround
Problem Fix/Workaround
complete.
– The Baudrate is odd and different from 1.
– The Polarity is set to 1.
– The Phase is set to 0.
6242E–ATARM–11-Sep09

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