D12363VF33V Renesas Electronics America, D12363VF33V Datasheet - Page 267

IC H8S/2363 MCU ROMLESS 128QFP

D12363VF33V

Manufacturer Part Number
D12363VF33V
Description
IC H8S/2363 MCU ROMLESS 128QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of D12363VF33V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
84
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
For Use With
YR0K42378FC000BA - KIT EVAL FOR H8S/2378
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12363VF33V
Manufacturer:
ST
Quantity:
67 000
Part Number:
D12363VF33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
D12363VF33V
Manufacturer:
RENSAS
Quantity:
20 000
If a refresh request and external bus release request occur simultaneously, the order of priority is
as follows:
6.10.2
Table 6.9 shows pin states in the external bus released state.
Table 6.9
Pins
A23 to A0
D15 to D0
CSn (n = 7 to 0)
UCAS, LCAS
AS
RD
OE
HWR, LWR
DACKn (n = 1, 0)
(High) External bus release > External access by internal bus master (Low)
(High) Refresh > External bus release (Low)
Pin States in External Bus Released State
Pin States in Bus Released State
Pin State
High impedance
High impedance
High impedance
High impedance
High impedance
High impedance
High impedance
High impedance
High
Rev.6.00 Mar. 18, 2009 Page 207 of 980
Section 6 Bus Controller (BSC)
REJ09B0050-0600

Related parts for D12363VF33V