MC9S12XA512CAG Freescale Semiconductor, MC9S12XA512CAG Datasheet - Page 1245

IC MCU 512K FLASH 144-LQFP

MC9S12XA512CAG

Manufacturer Part Number
MC9S12XA512CAG
Description
IC MCU 512K FLASH 144-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheets

Specifications of MC9S12XA512CAG

Core Processor
HCS12X
Core Size
16-Bit
Speed
80MHz
Connectivity
EBI/EMI, I²C, IrDA, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
119
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.5 V
Data Converters
A/D 24x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Processor Series
S12XA
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
32 KB
Interface Type
CAN, I2C, SCI, SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
119
Number Of Timers
12
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
EVB9S12XDP512E
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (10 bit, 24 Channel)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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1
2
3
Freescale Semiconductor
Conditions are 3.15 V < V
I/O Characteristics for all I/O pins except EXTAL, XTAL,XFC,TEST, VREGEN and supply pins.
17
18
Maximum leakage current occurs at maximum operating temperature. Current decreases by approximately one-half for each
8 C to 12 C in the temper ature range from 50 C to 125 C.
Refer to
Parameter only applies in stop or pseudo stop mode.
C Port H, J, P interrupt input pulse filtered
C Port H, J, P interrupt input pulse passed
Section A.1.4, “Current Injection”
DD35
< 3.6 V temperature from –40 C to +140 C, unless otherwise noted
Table A-6. 3.3-V I/O Characteristics
MC9S12XDP512 Data Sheet, Rev. 2.21
for more details
3
3
t
t
PULSE
PULSE
10
Appendix A Electrical Characteristics
3
1247
s
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