MC9S12XA512CAG Freescale Semiconductor, MC9S12XA512CAG Datasheet - Page 1133
![IC MCU 512K FLASH 144-LQFP](/photos/12/38/123875/mc9s12xa512cag_sml.jpg)
MC9S12XA512CAG
Manufacturer Part Number
MC9S12XA512CAG
Description
IC MCU 512K FLASH 144-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Specifications of MC9S12XA512CAG
Core Processor
HCS12X
Core Size
16-Bit
Speed
80MHz
Connectivity
EBI/EMI, I²C, IrDA, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
119
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.5 V
Data Converters
A/D 24x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Processor Series
S12XA
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
32 KB
Interface Type
CAN, I2C, SCI, SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
119
Number Of Timers
12
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
EVB9S12XDP512E
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (10 bit, 24 Channel)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
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Manufacturer
Quantity
Price
Company:
Part Number:
MC9S12XA512CAG
Manufacturer:
Freescale
Quantity:
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Company:
Part Number:
MC9S12XA512CAG
Manufacturer:
Freescale Semiconductor
Quantity:
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27.4.2.2.1
The Flash module contains a 16-bit multiple-input signature register (MISR) for each Flash block to
generate a 16-bit signature based on selected Flash array data. If multiple Flash blocks are selected for
simultaneous compression, then the signature from each Flash block is further compressed to generate a
single 16-bit signature. The final 16-bit signature, found in the FDATA registers after the data compress
operation has completed, is based on the following logic equation which is executed on every data
compression cycle during the operation:
where MISR is the content of the internal signature register associated with each Flash block and DATA
is the data to be compressed as shown in
During the data compress operation, the following steps are executed:
Freescale Semiconductor
1. MISR for each Flash block is reset to 0xFFFF.
2. Initialized DATA equal to 0xFFFF is compressed into the MISR for each selected Flash block
3. DATA equal to the selected Flash array data range is read and compressed into the MISR for each
4. DATA equal to the selected Flash array data range is read and compressed into the MISR for each
5. If Flash block 0 is selected for compression, DATA equal to the contents of the MISR for Flash
6. If Flash block 1 is selected for compression, DATA equal to the contents of the MISR for Flash
7. If Flash block 2 is selected for compression, DATA equal to the contents of the MISR for Flash
8. If Flash block 3 is selected for compression, DATA equal to the contents of the MISR for Flash
9. The contents of the MISR for Flash block 0 are written to the FDATA registers.
DATA[0]
which results in the MISR containing 0x0001.
selected Flash block with addresses incrementing.
selected Flash block with addresses decrementing.
block 0 is compressed into the MISR for Flash block 0. If data in Flash block 0 was not selected
for compression, the MISR for Flash block 0 contains 0xFFFF.
block 1 is compressed into the MISR for Flash block 0.
block 2 is compressed into the MISR for Flash block 0.
block 3 is compressed into the MISR for Flash block 0.
+
MISR[15:0] = Q[15:0]
+
= Exclusive-OR
>
D Q
M0
Data Compress Operation
DATA[1]
MISR[15:0] = {MISR[14:0], ^MISR[15,4,2,1]} ^ DATA[15:0]
+
>
D Q
M1
+
DATA[2]
+
Figure 27-27. 16-Bit MISR Diagram
MC9S12XDP512 Data Sheet, Rev. 2.21
>
D Q
M2
+
Figure
DATA[3]
+
>
D Q
27-27.
M3
DATA[4]
+
>
D Q
M4
Chapter 27 512 Kbyte Flash Module (S12XFTX512K4V2)
+
DATA[5]
+
>
D Q
M5
...
DATA[15]
+
>
M15
D Q
Eqn. 27-1
1135
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