ST72F344K4T6 STMicroelectronics, ST72F344K4T6 Datasheet - Page 27
ST72F344K4T6
Manufacturer Part Number
ST72F344K4T6
Description
MCU 8BIT 16KB FLASH MEM 32-LQFP
Manufacturer
STMicroelectronics
Series
ST7r
Datasheet
1.ST72F344K2T6.pdf
(247 pages)
Specifications of ST72F344K4T6
Core Processor
ST7
Core Size
8-Bit
Speed
8MHz
Connectivity
I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
24
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
32-LQFP
Processor Series
ST72F3x
Core
ST7
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
I2C, SCI, SPI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
34
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
ST72F34X-SK/RAIS, ST7MDT40-EMU3, STX-RLINK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
For Use With
497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-5611
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ST72F344K4T6
Manufacturer:
STMicroelectronics
Quantity:
10 000
Company:
Part Number:
ST72F344K4T6TR
Manufacturer:
STMicroelectronics
Quantity:
10 000
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ST72344xx ST72345xx
4
4.1
4.2
4.3
Flash program memory
Introduction
The ST7 single voltage extended Flash (XFlash) is a non-volatile memory that can be
electrically erased and programmed either on a byte-by-byte basis or up to 32 bytes in
parallel.
The XFlash devices can be programmed off-board (plugged in a programming tool) or on-
board using In-Circuit Programming or In-Application Programming.
The array matrix organization allows each sector to be erased and reprogrammed without
affecting other sectors.
Main features
●
●
●
●
●
Programming modes
The ST7 can be programmed in three different ways:
●
●
●
ICP (in-circuit programming)
IAP (in-application programming)
ICT (in-circuit testing) for downloading and executing user application test patterns in
RAM
Sector 0 size configurable by option byte
Read-out and write protection
Insertion in a programming tool. In this mode, Flash sectors 0 and 1, option byte row
and data EEPROM (if present) can be programmed or erased.
In-circuit programming. In this mode, Flash sectors 0 and 1, option byte row and data
EEPROM (if present) can be programmed or erased without removing the device from
the application board.
In-application programming. In this mode, sector 1 and data EEPROM (if present) can
be programmed or erased without removing the device from the application board and
while the application is running.
Doc ID 12321 Rev 5
Flash program memory
27/247
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