MT47H64M8CB-3:B Micron Technology Inc, MT47H64M8CB-3:B Datasheet - Page 133

• Manufacturer Part Number: MT47H64M8CB-3:B
• Description: IC DDR2 SDRAM 512MBIT 3NS 60FBGA
• Manufacturer: Micron Technology Inc

Specifications of MT47H64M8CB-3:B

• Format - Memory: RAM
• Memory Type: DDR2 SDRAM
• Memory Size: 512M (64M x 8)
• Speed: 3ns
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.9 V
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 60-FBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Figure 91:
PDF: 09005aef8117c18e, Source: 09005aef8211b2e6
512MbDDR2_2.fm - Rev. K 8/06 EN
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS 0.42
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range
SEATING PLANE
for production devices. Although considered final, these specifications are subject to change, as further product
60X Ø0.45
0.10 C
8.00
BALL A9
60-Ball FBGA Package – 10mm x 10mm (x4, x8)
4.00
0.80 ±0.05
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
C
Note:
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
3.20
All dimensions are in millimeters.
development and data characterization sometimes occur.
10.00 ±0.10
1.80 ±0.05
0.80 TYP
6.40
CTR
C L
5.00 ±0.05
their respective owners.
C L
0.80 TYP
5.00 ±0.05
BALL A1
0.155 ±0.013
BALL A1 ID
133
10.00 ±0.10
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.20 MAX
512Mb: x4, x8, x16 DDR2 SDRAM
SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2%Ag OR
96.5% Sn, 3%Ag, 0.5%Cu
NON SOLDER MASK DEFINED BALL PAD: Ø0.33
SUBSTRATE MATERIAL: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
Package Dimensions
©2004 Micron Technology, Inc. All rights reserved.
BALL A1 ID