MC9S08SH4CTG Freescale, MC9S08SH4CTG Datasheet - Page 28

MC9S08SH4CTG

Manufacturer Part Number
MC9S08SH4CTG
Description
Manufacturer
Freescale
Datasheet

Specifications of MC9S08SH4CTG

Cpu Family
HCS08
Device Core Size
8b
Frequency (max)
40MHz
Interface Type
I2C/SCI/SPI
Total Internal Ram Size
256Byte
# I/os (max)
13
Number Of Timers - General Purpose
1
Operating Supply Voltage (typ)
3.3/5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
2.7V
On-chip Adc
8-chx10-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
16
Package Type
TSSOP
Program Memory Type
Flash
Program Memory Size
4KB
Lead Free Status / RoHS Status
Compliant

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Chapter 2 Pins and Connections
When an on-chip peripheral system is controlling a pin, data direction control bits still determine what is
read from port data registers even though the peripheral module controls the pin direction by controlling
the enable for the pin’s output buffer. For information about controlling these pins as general-purpose I/O
pins, see
The MC9S08SH8 devices contain a ganged output drive feature that allows a safe and reliable method of
allowing pins to be tied together externally to produce a higher output current drive. See
“Ganged
28
Chapter 6, “Parallel Input/Output
Output” for more information for configuring the port pins for ganged output drive.
To avoid extra current drain from floating input pins, the reset initialization
routine in the application program should either enable on-chip pull-up
devices or change the direction of unused pins to outputs so they do not float.
When using the 8-pin devices, the user must either enable on-chip pullup
devices or change the direction of non-bonded out port B and port C pins to
outputs so the pins do not float.
When using the 16-pin devices, the user must either enable on-chip pullup
devices or change the direction of non-bonded out port C pins to outputs so
the pins do not float.
MC9S08SH8 MCU Series Data Sheet, Rev. 3
Control.”
NOTE
Freescale Semiconductor
Section 6.3,

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