S25FL128SAGMFI011 Spansion, S25FL128SAGMFI011 Datasheet - Page 3

• Manufacturer Part Number: S25FL128SAGMFI011
• Description: Flash 128Mb 3V 133MHz Serial NOR Flash
• Manufacturer: Spansion

Specifications of S25FL128SAGMFI011

• Rohs: yes

Features
 Density
 Serial Peripheral Interface (SPI)
 READ Commands
 Programming (1.5 Mbytes/s)
 Erase (0.5 to 0.65 Mbytes/s)
 Cycling Endurance
S25FL128S and S25FL256S
S25FL128S 128 Mbit (16 Mbyte)
S25FL256S 256 Mbit (32 Mbyte)
MirrorBit
CMOS 3.0 Volt Core with Versatile I/O
Serial Peripheral Interface with Multi-I/O
Data Sheet
– 128 Mbits (16 Mbytes)
– 256 Mbits (32 Mbytes)
– SPI Clock polarity and phase modes 0 and 3
– Double Data Rate (DDR) option
– Extended Addressing: 24- or 32-bit address options
– Serial Command set and footprint compatible with S25FL-A,
– Multi I/O Command set and footprint compatible with
– Normal, Fast, Dual, Quad, Fast DDR, Dual DDR, Quad DDR
– AutoBoot - power up or reset and execute a Normal or Quad read
– Common Flash Interface (CFI) data for configuration information.
– 256 or 512 Byte Page Programming buffer options
– Quad-Input Page Programming (QPP) for slow clock systems
– Hybrid sector size option - physical set of thirty two 4-kbyte sectors
– Uniform sector option - always erase 256-kbyte blocks for software
– 100,000 Program-Erase Cycles on any sector typical
S25FL-K, and S25FL-P SPI families
S25FL-P SPI family
command automatically at a preselected address
at top or bottom of address space with all remaining sectors of
64 kbytes, for compatibility with prior generation S25FL devices
compatibility with higher density and future devices.
®
Flash Non-Volatile Memory
Publication Number S25FL128S_256S_00
 Data Retention
 Security features
 Spansion
 Core Supply Voltage: 2.7V to 3.6V
 I/O Supply Voltage: 1.65V to 3.6V
 Temperature Range:
 Packages (all Pb-free)
Revision 05
– 20 Year Data Retention typical
– One Time Program (OTP) array of 1024 bytes
– Block Protection:
– Advanced Sector Protection (ASP)
Architecture
– SO16 and FBGA packages
– Industrial (-40
– Automotive In-Cabin (-40
– 16-lead SOIC (300 mil)
– WSON 6 x 8 mm
– BGA-24 6 x 8 mm
– Known Good Die and Known Tested Die
– Status Register bits to control protection against program or
– Hardware and software control options
– Individual sector protection controlled by boot code or password
– 5 x 5 ball (FAB024) and 4 x 6 ball (FAC024) footprint options
erase of a contiguous range of sectors.
®
65 nm MirrorBit Technology with Eclipse
°
C to +85
Issue Date July 12, 2012
°
C)
°
C to +105
°
C)
™