S25FL128SAGMFI011 Spansion, S25FL128SAGMFI011 Datasheet - Page 151

• Manufacturer Part Number: S25FL128SAGMFI011
• Description: Flash 128Mb 3V 133MHz Serial NOR Flash
• Manufacturer: Spansion

Specifications of S25FL128SAGMFI011

• Rohs: yes

14. Revision History
July 12, 2012 S25FL128S_256S_00_05
Revision 01 (May 25, 2011)
Revision 02 (November 18, 2011)
Global
Performance Summary
Power-Up and Power-Down
DC Characteristics
SDR AC Characteristics
DDR AC Characteristics
Capacitance Characteristics
Physical Interface
ASP Register
Persistent Protection Bits
Register Read or Write
Page Program (PP 02h or 4PP 12h)
Embedded Algorithm Performance
Tables
Device ID and Common Flash Interface
(ID-CFI) Address Map
Ordering Information
Section
Initial release
Promoted data sheet to Preliminary status
Corrected minor typos and grammatical errors
Updated the Serial Read 50 MHz current consumption value from 14 mA (max) to 16 mA (max)
Updated the Serial Read 133 MHz current consumption value from 25 mA (max) to 33 mA (max)
Removed the statement “The device draws I_CC1 (50 MHz value) during t_PU”
Updated the I_CC1 Active Power Supply Current (READ) Serial SDR @ 50 MHz maximum value
from 14 mA to 16 mA
Updated the I_CC1 Active Power Supply Current (READ) Serial SDR @ 133 MHz maximum value
from 25 mA to 33 mA
Added the t_CSH CS# Active Hold Time (Relative to SCK) maximum value of 3000 ns, with a note
indicating that this only applies during the Program/Erase Suspend/Resume commands
Added the t_CSH CS# Active Hold Time (Relative to SCK) maximum value of 3000 ns, with a note
indicating that this only applies during the Program/Erase Suspend/Resume commands
Added a Note 1, pointing users to the IBIS models for more details on capacitance
Corrected pin 5 of the SOIC 16 Connection Diagram from NC to DNU
Corrected pin 13 of the SOIC 16 Connection Dig ram from DNU to NC
Replaced the WNF008 drawing with the WNG008 drawing
Updated the FAB024 drawing to the latest version
Corrected the statement “The programming time of the ASP Register is the same as the typical byte
programming time” to “The programming time of the ASP Register is the same as the typical page
programming time”
Corrected the statement “Programming a PPB bit requires the typical byte programming time” to
“Programming a PPB bit requires the typical page programming time”
Corrected the statement “…the device remains busy and unable to receive most new operation
commands.” to “..the device remains busy. Under this condition, only the CLSR, WRDI, RDSR1,
RDSR2, and software RESET commands are valid commands.”
Removed the statement “If more than a page of data is sent to the device, previously latched data
are discarded and the last page worth of data (either 256 or 512 bytes) are programmed in the page.
This is the result of the device being equipped with a page program buffer that is only page size in
length.”
Updated the t_W WRR Write Time typical value from 100 ms to 140 ms and the maximum value
from 200 ms to 500 ms
Updated t_PP Page Programming Time (256 bytes) maximum value from 550 µs to 750 µs
Added Note 3 and Note 4 to Table 10.7 to note shared performance values across other commands
Updated the t_ESL Erase Suspend Latency maximum value from 40 µs to 45 µs
CFI Alternate Vendor-Specific Extended Query Parameter 9Ah - EHPLC DDR table: corrected the
data of offset 01h from 32h to 2Ah
Added E0, E1, F0, F1, G0, and G1 as valid model numbers
Broke out the 2 character length model number decoder into separate characters to clarify format
and save space
Corrected the valid S25FLxxxSAGMFI model numbers from R0 and R1 to G0 and G1
Updated the Package Marking format to help identify speed differences across similar devices
Added G0 and G1 as valid model number combinations for SDR SOIC OPNs
Removed 20, 21, 30, and 31 as valid model numbers combinations for DDR BGA OPNs
D a t a
S25FL128S and S25FL256S
S h e e t
Description
151