MT57W1MH18C Micron Semiconductor Products, Inc., MT57W1MH18C Datasheet - Page 3

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MT57W1MH18C

Manufacturer Part Number
MT57W1MH18C
Description
18Mb Ddrii SRAM, 1.8V Vdd, Hstl, 2-Word Burst,
Manufacturer
Micron Semiconductor Products, Inc.
Datasheet

Available stocks

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Part Number
Manufacturer
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Part Number:
MT57W1MH18CF-4
Manufacturer:
MICRON/美光
Quantity:
20 000
Programmable Impedance Output
Buffer
impedance output buffers. This allows a user to match
the driver impedance to the system. To adjust the
impedance, an external precision resistor (RQ) is con-
nected between the ZQ ball and V
resistor must be five times the desired impedance. For
example, a 350 W resistor is required for an output
impedance of 70 W . To ensure that output impedance is
one-fifth the value of RQ (within 15 percent), the range
of RQ is 175 W to 350 W . Alternately, the ZQ ball can be
connected directly to V
device in a minimum impedance mode.
because, over time, variations may occur in supply
voltage and temperature. The device samples the value
of RQ. Impedance updates are transparent to the sys-
tem; they do not affect device operation, and all data
sheet timing and current specifications are met during
an update.
set at 50 W . To guarantee optimum output driver
impedance after power-up, the SRAM needs 1,024
cycles to update the impedance. The user can operate
the part with fewer than 1,024 clock cycles, but optimal
output impedance is not guaranteed.
Clock Considerations
maximum output, data valid window. It can be placed
into a stopped-clock state to minimize power, with a
18Mb: 2 Meg x 8, 1 Meg x 18, 512K x 36, 1.8V V
MT57W1MH18C_H.fm – Rev. H, Pub. 3/03
The DDR SRAM is equipped with programmable
Output impedance updates may be required
The device will power up with an output impedance
This device utilizes internal delay-locked loops for
DD
DD
, HSTL, DDR SIO SRAM
Q, which will place the
SS
. The value of the
3
2 MEG
modest restart time of 1,024 clock cycles. Circuitry
automatically resets the DLL when the absence of an
input clock is detected. See Micron Technical Note TN-
54-02 for more information on clock DLL start-up pro-
cedures.
indicate data validity. Data changes occur very near to
the rising edges of CQ and CQ#.
Single Clock Mode
clock pair by tying C and C# HIGH. In this mode, the
SRAM will use K and K# in place of C and C#. This
mode provides the most rapid data output but does
not compensate for system clock skew and flight
times.
output data. CQ and CQ# are both rising edge and fall-
ing edge accurate and are 180° out of phase. Either or
both may be used for output data capture. K or C rising
edge triggers CQ rising and CQ# falling edge. CQ rising
edge indicates first data response for QDRI and DDRI
(version 1, non-DLL) SRAM, while CQ# rising edge
indicates first data response for QDRII and DDRII (ver-
sion 2, DLL) SRAM.
Depth Expansion
LD# signal for each bank. R/W# can be shared among
all SRAMs in the system, if driver fanout permits.
Optional-use echo clocks are provided to precisely
The SRAM can be used with the single K and K#
The output echo clocks are precise references to
Depth expansion is easily done by providing a new
1.8V V
Micron Technology, Inc., reserves the right to change products or specifications without notice.
X
8, 1 MEG
DD
, HSTL, DDR SIO SRAM
X
18, 512K
©2003 Micron Technology, Inc.
X
36

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