MT57W1MH18C Micron Semiconductor Products, Inc., MT57W1MH18C Datasheet - Page 27

• Manufacturer Part Number: MT57W1MH18C
• Description: 18Mb Ddrii SRAM, 1.8V Vdd, Hstl, 2-Word Burst,
• Manufacturer: Micron Semiconductor Products, Inc.

NOTE:
Data Sheet Designation
supply and temperature range for production devices. Although considered final, these specifications are sub-
ject to change, as further product development and data characterization sometimes occur.
18Mb: 2 Meg x 8, 1 Meg x 18, 512K x 36, 1.8V V
MT57W1MH18C_H.fm – Rev. H, Pub 3/03
1. All dimensions are in millimeters.
SOLDER BALL DIAMETER REFERS
TO POST REFLOW CONDITION. THE
PRE-REFLOW DIAMETER IS Ø 0.40
No Marking: This data sheet contains minimum and maximum limits specified over the complete power
15.00 ±0.10
E-mail: [e-mail], Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
165X Ø 0.45
BALL A11
7.50 ±0.05
7.00 ±0.05
Micron, the M logo, and the Micron logo are trademarks and/or service marks of of Micron Technology, Inc.
DD
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
, HSTL, DDR SIO SRAM
0.85 ±0.075
5.00 ±0.05
13.00 ±0.10
10.00
6.50 ±0.05
1.00
TYP
165-Ball FBGA
Figure 11:
C
1.00
TYP
27
BALL A1
PIN A1 ID
2 MEG
14.00
SEATING PLANE
®
0.12 C
1.8V V
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.20 MAX
X
8, 1 MEG
DD
, HSTL, DDR SIO SRAM
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb
SOLDER BALL PAD: Ø .33mm
X
PIN A1 ID
18, 512K
©2003 Micron Technology, Inc.
X
36