MT54V1MH18A Micron Semiconductor Products, Inc., MT54V1MH18A Datasheet

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MT54V1MH18A

Manufacturer Part Number
MT54V1MH18A
Description
18Mb QDR SRAM, 2.5V Vdd, Hstl, 2-Word Burst,
Manufacturer
Micron Semiconductor Products, Inc.
Datasheet
18Mb QDR
2-WORD BURST
Features
• Separate independent read and write data ports
• 100 percent bus utilization DDR READ and WRITE
• High frequency operation with future migration to
• Fast clock to valid data times
• Full data coherency, providing most current data
• Two-tick burst counter for low DDR transaction size
• Double data rate operation on read and write ports
• Two input clocks (K and K#) for precise DDR timing
• Two output clocks (C and C#) for precise flight time
• Optional-use echo clocks (CQ and CQ#) for flexible
• Single address bus
• Simple control logic for easy depth expansion
• Internally self-timed, registered writes
• 2.5V core and 1.5 to 1.8V (±0.1V) HSTL I/O
• Clock-stop capability
• 13mm x 15mm, 1mm pitch, 11 x 15 grid FBGA
• User-programmable impedance output
• JTAG boundary scan
NOTE:
18Mb: 2.5V V
MT54V1MH18A_16_F.fm – Rev. F, Pub. 3/03
Options
• Clock Cycle Timing
• Configurations
• Package
• Operating Temperature Range
1. A Part Marking Guide for the FBGA devices can be found on
with concurrent transactions
operation
higher clock frequencies
at clock rising edges only
and clock skew matching—clock and data delivered
together to receiving device
receive data synchronization
package
Micron’s Web site—http://www.micron.com/numberguide.
6ns (167 MHz)
7.5ns (133 MHz)
10ns (100 MHz)
1 Meg x 18
165-ball, 13mm x 15mm FBGA
Commercial (0°C £ T
512K x 36
DD
, HSTL, QDRb2 SRAM
A
£ +70°C)
SRAM
MT54V512H36A
MT54V1MH18A
Marking
None
-7.5
-10
-6
F
1
1
Table 1:
General Description
nous, pipelined burst SRAM employs high-speed, low-
power CMOS designs using an advanced 6T CMOS
process.
(double data rate) ports to access the memory array.
The read port has dedicated data outputs to support
READ operations. The write port has dedicated data
inputs to support WRITE operations. This architecture
eliminates the need for high-speed bus turnaround.
Access to each port is accomplished using a common
address bus. Addresses for reads and writes are latched
on rising edges of the K and K# input clocks, respec-
tively. Each address location is associated with two
words that burst sequentially into or out of the device.
Since data can be transferred into and out of the device
on every rising edge of both clocks (K and K# and C
and C#), memory bandwidth is maximized and system
design is simplified by eliminating bus turnarounds.
MT54V1MH18A
MT54V512H36A
PART NUMBER
MT54V1MH18AF-xx
MT54V512H36AF-xx
The Micron
The QDR architecture consists of two separate DDR
2.5V V
Figure 1: 165-Ball FBGA
®
Valid Part Numbers
DD
1 MEG x 18, 512K x 36
QDR™ (Quad Data Rate™) synchro-
, HSTL, QDRb2 SRAM
DESCRIPTION
1 Meg x 18, QDRb2 FBGA
512K x 36, QDRb2 FBGA
©2003 Micron Technology, Inc.

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